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采用熔铸法制备了CeO2纳米颗粒增强的Sn58Bi复合钎料，研究了CeO2纳米颗粒对Sn58Bi钎料及其钎焊接头组织与性能的影响。结果表明：添加CeO2纳米颗粒，细化了Sn58Bi钎料的共晶组织，Bi相由块状逐渐转变为细条状；添加0.125～0.5 mass%的CeO2纳米颗粒提高了复合钎料的润湿性；在添加量0.5 mass%时复合钎料的抗拉强度最大，为68.9 MPa,较基体钎料提升37%;复合钎料与Cu基板可实现良好焊接。添加CeO2纳米颗粒降低了钎焊接头界面金属间化合物(IMC)层的厚度，形态由棒状转变为较为平整的扇贝状，钎焊接头剪切强度提高；当添加量为0.5 mass%时，钎焊接头的剪切强度最大，为45.4 MPa,较于基体钎料接头提升了32.4%,断裂位置由基体钎料接头的IMC/Cu基板界面向IMC/钎缝界面迁移；断裂机制由呈片状解理刻面+少量冰糖状IMC解理组成的脆性断裂转变为钎缝准解理为主的韧-脆混合断裂。
Abstract：CeO2 nanoparticles reinforced Sn58Bi composite solder was prepared by melting casting method, and the effect of CeO2 nanoparticles on microstructure and properties of the Sn58Bi solder and its solder joints was studied. The results show that the addition of CeO2 nanoparticles refines the eutectic structure of the Sn58Bi solder, and the Bi phase gradually transforms from block-like to fine needle-like. The addition of 0.125-0.5 mass% CeO2 nanoparticles improves the wettability of the composite solders. When the addition amount reaches 0.5 mass%, the tensile strength of the composite solder is the highest of 68.9 MPa, which is 37% higher than that of the matrix solder. Composite solder can achieve good welding with Cu substrates. The addition of CeO2 nanoparticles reduces the thickness of the intermetallic compound(IMC) layer at the interface of the solder joint, and the morphology changes from rod-shaped to relatively flat fan-shaped, resulting in an increase in the shear strength of the solder joint. When the addition amount is 0.5 mass%, the maximum shear strength of the solder joint is 45.4 MPa, which is 32.4% higher than that of the matrix solder joint. The fracture position shifts from the IMC/Cu substrate interface of the matrix solder joint to the IMC/solder joint interface. The fracture mechanism changes from brittle fracture composed of lamellar cleavage facets and a small amount of dendritic IMC cleavage to ductile-brittle mixed fracture dominated by quasi-cleavage of the solder.
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基本信息:
DOI：10.13289/j.issn.1009-6264.2024-0224
中图分类号:TG425
引用信息:
[1]陈伟明,张柯柯,范玉春等.CeO_2纳米颗粒增强Sn58Bi钎料及其钎焊接头的组织与性能[J].材料热处理学报,2025,46(03):215-225.DOI:10.13289/j.issn.1009-6264.2024-0224.
基金信息:
国家自然科学基金(U1604132); 中原基础研究领军人才(ZYYCYU202012130); 河南省国际合作重点项目(2024100014); 河南省科技攻关项目(242102230048)