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采用热压烧结制备了TiC10 vol%/Cu复合材料，分别分析了TiC化学镀铜改性和原位形成对TiC/Cu复合材料性能的影响，探讨了固态下TiC颗粒原位形成机制。结果表明：TiC颗粒不经过敏化和活化处理同样可以获得较好的镀铜效果，既降低了镀铜成本，又避免了杂质元素的掺入；固态原位形成TiC的大小与分布受石墨粉的大小和分布控制，而TiC颗粒的形成过程受Ti原子扩散所控制；原位形成的TiC/Cu复合材料具有较高的致密度和较低的膨胀系数，但导电率要低于化学镀铜TiC试样，同时，TiC经化学镀铜处理后，同样可以显著降低复合材料的膨胀系数。
Abstract：TiC10 vol%/Cu composites were prepared by hot pressing sintering, and the effects of TiC chemical copper plating modification and in-situ formation on the properties of the TiC/Cu composites were analyzed. The in-situ formation mechanism of TiC particles in the solid state was discussed. The results show that TiC particles can achieve good copper plating effect without sensitization and activation treatment, which not only reduces the cost of copper plating but also avoids the doping of impurity elements. The size and distribution of in-situ formed TiC in solid state are controlled by the size and distribution of graphite, while the formation process of TiC particles is controlled by the diffusion of Ti atoms. The in-situ formed TiC/Cu composite has high density and low expansion coefficient, but its conductivity is lower than that of chemical copper-plated TiC/Cu sample. Meanwhile, TiC treated with chemical copper plating can significantly reduce the expansion coefficient of the composites.
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基本信息:
DOI：10.13289/j.issn.1009-6264.2024-0186
中图分类号:TB333
引用信息:
[1]张剑平,孙涛,罗军明等.热压烧结制备TiC/Cu复合材料的热膨胀性能[J].材料热处理学报,2025,46(03):44-50.DOI:10.13289/j.issn.1009-6264.2024-0186.
基金信息:
国家自然科学基金(52161040)