电脉冲固溶对Al-22%Si-1.5%Cu合金组织的影响Effects of current pulse during solution process on microstructure of AI-22%Si-1.5%Cu alloy
何力佳,齐锦刚,王建中,曹丽云,苍大强
摘要(Abstract):
利用光学显微镜观察及显微硬度测量等方法研究了在脉冲电流作用下,Al-22%Si-1.5%Cu合金经过固溶、时效后其显微组织及基体性能的变化。结果表明,采用短时间高密度脉冲电流作用于Al-22%Si-1.5%Cu合金固溶过程前期(作用时间为120S),可明显改善该合金初生硅相及Al_2Cu相的形态和分布、显著提高基体的显微硬度。在固态相变经典形核理论的基础上,本文讨论了其作用机理。分析后认为脉冲电流影响了溶质原子的非平衡扩散过程,提高了固态相变的驱动力场从而降低扩散能垒,强化了溶质粒子扩散过程。
关键词(KeyWords): 固溶处理;脉冲电流;组织形态;能垒
基金项目(Foundation): 辽宁省高校重点实验室项目(200516204);; 国家自然科学基金(50674054)
作者(Author): 何力佳,齐锦刚,王建中,曹丽云,苍大强
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