SiCp/6061Al复合材料热变形行为及微观组织Hot deformation behavior and microstructure of SiCp/6061Al composites
崔闯,王金辉,王明亮,金培鹏
摘要(Abstract):
对SiC颗粒增强6061铝基复合材料在一定的应变速率(0.0001~0.1 s-1)和一定的变形温度(300~450℃)下进行热压缩试验,对热变形行为进行分析。结果表明:复合材料流变应力随着应变速率的增大而增大,随着变形温度的升高而降低,呈现出正应变速率敏感性。复合材料的热流变行为可以用双曲正弦形式的本构方程来描述,并通过线性回归分析,计算出复合材料的应变敏感指数n为8.0678,变形激活能Q为366.27 kJ/mol,其变形机制为晶格扩散控制的弥散强化机制。同时,观察了复合材料微观变形组织,可以看出热压缩后晶粒明显被拉长,颗粒在变形过程中重新排布,但是在高温低应变速率下,因动态再结晶的发生,这种现象不是很明显。
关键词(KeyWords): SiC颗粒增强铝基;复合材料;热压缩;显微组织
基金项目(Foundation): 国家重点基础研究发展计划资助(2011CB612200)
作者(Author): 崔闯,王金辉,王明亮,金培鹏
DOI: 10.13289/j.issn.1009-6264.2014.04.007
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