周贤良,吴开阳,邹爱华,华小珍,阙玉龙

• 1:南昌航空大学材料学院
• 2:南京航空航天大学材料学院

摘要(Abstract)：

通过无压渗透方法制得不同孔隙率SiCp/Al复合材料,采用了有限元数值模拟方法并与实验相结合研究了孔隙率对复合材料热导率的影响,并与MEMA模型计算值进行了对比。结果表明:通过改变无压浸渗温度和时间,可以制备出2.8%~9.4%范围内可调的含孔隙复合材料;在有限元数值模拟中,当孔隙率为小于6%时,热导率下降较快,反之,下降平缓。含孔隙复合材料有限元数值模拟值和实验结果较吻合,有一定的参考价值。随着孔隙率的增大,MEMA模型计算值和有限元模拟值的偏差越大。

关键词(KeyWords)： SiCp/Al复合材料;热导率;有限元模拟;孔隙率;MEMA模型

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51166011);; 江西省金属材料微结构调控重点实验室开放基金(JW201423003);; 航空基金(2012ZF56024);; 航天创新基金(CASC201106)

作者(Author): 周贤良,吴开阳,邹爱华,华小珍,阙玉龙

DOI: 10.13289/j.issn.1009-6264.2015.07.039

参考文献(References)：

• [1]Warren H,Darrell R.Aluminum metal metal matrix composites[J].Advanced Materials&Processes,2004(2):39-42.
• [2]张建云,李亚红,崔霞,等.Si Cp/Al复合材料导热性能研究[J].热加工工艺,2010,39(16):72-74.ZHANG Jian-yun,LI Ya-hong,CUI Xia,et al.Study on thermal conductivity of Si Cp/Al composite[J].Hot Working Technology,2010,39(16):72-74.
• [3]Wang K K,Kang Y L,Song P G,et al.Preparation of Si Cp/A356 electronic packaging materials and its thixo-forging[J].Transaction of Nonferrous Matals Society of China,2010(20):S988-S992.
• [4]刘君武,郑治翔,吴玉程,等.近净成形制备Si C/Al复合材料I:Si C预成形坯的制备[J].中国有色金属学报,2007,17(11):1833-1834.LIU Jun-wu,ZHENG Zhi-xiang,WU Yu-cheng,et al.Fabrication of Si C/Al composites with near-net-shapeⅠ:Preparation of Si C preforms[J].The Chinese Journal of Nonferrous Metals,2007,17(11):1833-1834.
• [5]Hassenma D P H,Every A G,Tzou Y.Effect of reinforcement particle size on the thermal conductivity of a particulate-silicon carbide-reinforced aluminmum matrix composites[J].Journal of Materials Sicence Letters,1993,75(12):420-423.
• [6]房国丽,李进,杨智春,等.Si C/Al复合材料界面反应的热力学分析[J],宁夏工程技术,2007,6(1):76-79.FANG Guo-li,LI Jin,YANG Zhi-chun,et al.Study on thermodynamic of Si C/Al composite interface[J].Ningxia Engineering Technology,2007,6(1):76-79.
• [7]袁思伟,冯妍卉,王鑫,等.α-Al2O3介孔材料导热特性的模拟[J].物理学报,2014,63(1):014402.YUAN Si-wei,FENG Yan-hui,WANG xin,et al.Molecular dynamics simulation of thermal conductivity of mesoporousα-Al2O3[J].Acta Physica Sinica,2014,63(1):014402.
• [8]韦兴文,李明,周筱雨,等.孔隙率对PBX热导率影响的数值模拟[J].含能材料,2013,21(5):681-683.WEI Xing-wen,LI ming,ZHOU Xiao-yu,et al.Numerical simulation of the effects of the porosity on thermal conductivity of PBX[J].Chinese Journal of Energetic Materials,2012,21(5):681-683.
• [9]汪海英,尚嘉兰,刘国权,等.复相材料中第二相的空间分布状况的描述方法综述[J].力学进展,2000,30(25):558-563.WANG Hai-ying,SHANG Jia-lan,LIU Guo-quan,et al.Summary description method of spatial distribution of the second phase of the multiphase materials[J].Andances in Mechanics,2000,30(25):558-563.
• [10]褚克,贾成厂,梁冰雪,等.SiCp/Al复合材料中孔隙影响热导率的模型[C]//2009全国粉末冶金学术会议学术论文集,2009:162-168.ZHU Ke,JIA Cheng-chang,LIANG Bing-xue,et al.The thermal conductivity model of the effect of pores in Si Cp/Al composites[C]//The 2009National Academic Conference of Powder Metallurgy,2009:162-168.
• [11]李亚红.制备工艺对SiCp/Al复合材料组织和性能的影响[D].南昌:南昌航空大学,2011.LI Ya-hong.Effect of fabrication processing on microstructure and properties of Si Cp/Al composites[D].Nanchang:Nanchang Hang Kong University,2011.
• [12]黄昆.固体物理学[M].北京,高等教育出版社,1998.
• [13]Nan C W,Birringer R,Clarke D R,et al.Effective thermal conductivity of particulatecomposites with interfacial thermal resistance[J].Journal of Applied Physics,1997,81:6692-6699.

文章评论(Comment)：