Zn元素对SnBiIn焊料显微组织和性能的影响Effect of Zn element on microstructure and properties of SnBiIn solder
潘美诗,陈海燕,林逸,鲁少洲,董春涛,黄小汉,龙协,黄舜天,吴灏
摘要(Abstract):
在Sn_(58)Bi_(40)In_(12)合金中添加不同含量的Zn元素,利用扫描电镜和能谱仪分析了合金的显微组织和成分,借助X射线衍射仪和热重实验分析了合金的物相组成,研究了Zn元素含量对合金的抗拉强度、耐腐蚀性和焊接性能的影响,分析了Zn元素的影响机理。结果表明:Sn_(58)Bi_(40)In_(12)-xZn (x=0.5~2.5)合金由粗大树枝晶初晶Bi、方块状InBi-Sn共晶体、片层状Sn-Bi共晶体和长杆状Zn组成;加入1.5%~2.0%锌元素能促使Sn-BiIn共晶体和Sn-Bi共晶体析出,抑制了脆性相初晶Bi的析出,与此同时还改善了合金在钎焊时的润湿性能,从而提高了铸态合金的力学性能和焊接性能;其中Sn58Bi40In12-1.5Zn合金的抗拉强度为63.00 MPa,伸长率为24.82%,焊点的剪切强度为36.86 MPa,与Sn_(58)Bi_(40)In_(12)合金相比,抗拉强度提高了21.15%,伸长率增加了12.26%,焊点剪切强度提高了46.91%。
关键词(KeyWords): SnBiInZn焊料;显微组织;力学性能;焊接性能
基金项目(Foundation):
作者(Author): 潘美诗,陈海燕,林逸,鲁少洲,董春涛,黄小汉,龙协,黄舜天,吴灏
DOI: 10.13289/j.issn.1009-6264.2024-0529
参考文献(References):
- [1] 侯正军,陈玉华.无铅焊料的发展[J].电子与封装,2005,5(5):8-11.HOU Zheng-jun,CHEN Yu-hua.Progress of lead-free solder[J].Electronics & Packaging,2005,5(5):8-11.
- [2] 林鹏,杨思佳.电子器件钎料无铅化的研究现状及展望[J].理化检验(物理分册),2013,49(11):752-755.LIN Peng,YANG Si-jia.Research status and prospects of lead-free solder in electronic device[J].Physical Testing and Chemical Analysis (Part A:Physical Testing),2013,49(11):752-755.
- [3] Lillie E,Sandborn P,Humphrey D.Assessing the value of a lead-free solder control plan using cost-based FMEA[J].Microelectronics Reliability,2015,55(6):969-979.
- [4] Li W,Guo L,Li D,et al.Research overview on the electromigration reliability of SnBi solder alloy[J].Materials,2024,17(12):2848.
- [5] 朱文嘉,赵玲彦,把明芳,等.SnBi36Ag0.5Sbx无铅焊料界面结构研究[J].热加工工艺,2025,54(1):114-120.ZHU Wen-jia,ZHAO Ling-yan,BA Ming-fang,et al.Study on interface structure of SnBi36Ag0.5Sbx lead-free solder[J].Hot Working Technology,2025,54(1):114-120.
- [6] Cai C,Xu J,Wang H,et al.A comparative study of thermal fatigue life of Eutectic Sn-Bi,Hybrid Sn-Bi/SAC and SAC solder alloy BGAs[J].Microelectronics Reliability,2021,119:114065.
- [7] 徐衡,陈旭,罗登俊,等.SnBi基焊点在热作用下的可靠性和失效分析[J].微纳电子技术,2021,58(4):365-370.XU Heng,CHEN Xu,LUO Deng-jun,et al.Reliability and failure analysis of SnBi-based solder joints under thermal effect[J].Micronanoelectronic Technology,2021,58(4):365-370.
- [8] 徐衡,罗登俊,颜炎洪,等.微量元素添加对多元Sn-Bi系焊料合金组织与性能的影响[J].微纳电子技术,2021,58(2):124-130.XU Heng,LUO Deng-jun,YAN Yan-hong,et al.Effects of addition of trace elements on the structure and properties of multicomponent Sn-Bi based solder alloys[J].Micronanoelectronic Technology,2021,58(2):124-130.
- [9] 孙云龙,王敬泽,吴石,等.铟含量对Sn-Bi-In钎料性能及钎焊界面组织的影响[J].机械工程材料,2023,47(4):56-60.SUN Yun-long,WANG Jing-ze,WU Shi,et al.Effect of indium content on properties of Sn-Bi-In solder and structure at brazing interface[J].Materials for Mechanical Engineering,2023,47(4):56-60.
- [10] 溥存继,李才巨,彭巨擘,等.Sn基无铅焊料的研究进展[J].稀有金属材料与工程,2023,52(9):3302-3315.PU Cun-ji,LI Cai-ju,PENG Ju-bo,et al.Research progress of Sn-based lead-free solder[J].Rare Metal Materials and Engineering,2023,52(9):3302-3315.
- [11] Zhang T Y,Cheng Q,Zhu H Y,et al.Microstructure characterization of (Sn(1-x)Znx)57(In0.78Bi0.22)43 low melting point lead-free solder materials[J].Transactions of Nonferrous Metals Society of China,2023,33(1):201-208.
- [12] 陈一鸣,王正宏,马莒生,等.Sn-Zn系无铅焊料在波峰焊中的应用[J].电子元件与材料,2018,37(7):8-13.CHEN Yi-ming,WANG Zheng-hong,MA Ju-sheng,et al.Application of Sn-Zn lead-free solder on wave soldering[J].Electronic Components and Materials,2018,37(7):8-13.
- [13] 杨娇娇,彭言之,陈东东,等.In的添加对Sn-9Zn无铅焊料合金组织与性能的影响[J].稀有金属,2022,46(8):1031-1040.YANG Jiao-jiao,PENG Yan-zhi,CHEN Dong-dong,et al.Microstructure and properties of Sn-9Zn lead-free solder alloy with In addition[J].Chinese Journal of Rare Metals,2022,46(8):1031-1040.
- [14] Hu F Q,Zhang Q K,Jiang J J,et al.Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction[J].Materials Letters,2018,214:142-145.
- [15] El Basaty A B,Deghady A M,Eid E A.Influence of small addition of antimony (Sb) on thermal behavior,microstructural and tensile properties of Sn-9.0 Zn-0.5 Al Pb-free solder alloy[J].Materials Science and Engineering A,2017,701:245-253.
- [16] Liu Y,Tu K N.Low melting point solders based on Sn,Bi,and In elements[J].Materials Today Advances,2020,8:100115.
- [17] Yang L,Xiong Y,Zhang Y,et al.Microstructure and shear property of In-Sn-xAg solder joints fabricated by TLP bonding[J].Journal of Materials Science:Materials in Electronics,2019,30:18211-18219.
- [18] 申兵伟,徐明玥,杨尚荣,等.Sn-Bi基低温无铅焊料的研究进展[J].电子元件与材料,2023,42(2):144-152.SHEN Bing-wei,XU Ming-yue,YANG Shang-rong,et al.Research progress of Sn-Bi based low temperature lead-free solder[J].Electronic Components and Materials,2023,42(2):144-152.
- [19] 唐玲,张会,孟凡莹,等.铸态下Sn-Bi二元共晶焊料合金的组织特征及其力学性能[J].有色金属工程,2024,14(7):52-59.TANG Ling,ZHANG Hui,MENG Fan-ying,et al.Microstructure and mechanical properties of as-cast Sn-Bi eutectic solder alloys[J].Nonferrous Metals Engineering,2024,14(7):52-59.
- [20] Suganuma K.Microstructural features of lift-off phenomenon in through-hole circuit soldered by Sn-Bi alloy[J].Scripta Materialia,1998,38(9):1333-1340.
- [21] 万超,王玲,曹诺.铝合金无钎剂钎焊技术[J].电子工艺技术,2021,42(1):34-37.WAN Chao,WANG Ling,CAO Nuo,et al.Flux-free brazing technology for aluminum alloy[J].Electronics Process Technology,2021,42(1):34-37.
- [22] Ramos S L,Reyes V R,Gomes F L,et al.The role of eutectic colonies in the tensile properties of a Sn-Zn eutectic solder alloy[J].Materials Science and Engineering A,2020,776:138959.
- [23] Liu Y,Pu L,Yang Y,et al.A high-entropy alloy as very low melting point solder for advanced electronic packaging[J].Materials Today Advances,2020,7:100101.
- [24] 周健,孙扬善,薛烽.低熔点Sn-Zn-Bi 无铅钎料的组织和性能[J].金属学报,2005,41(7):743-749.ZHOU Jian,SUN Yang-shan,XUE Feng.Microstructures and properties of Sn-Zn-Bi solder alloys[J].Acta Metallurgica Sinica,2005,41(7):743-749.
- [25] Tu X,Yi D,Wu J,et al.Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints:Thermal behavior,microstructure and mechanical properties[J].Journal of Alloys and Compounds,2017,698:317-328.
文章评论(Comment):
|
||||||||||||||||||
|
||||||||||||||||||