胡佳智,陈冷

• 1:北京科技大学材料科学与工程学院

摘要(Abstract)：

研究了退火对磁控溅射Co/Cu多层膜微观结构和磁性能的影响。用扫描电子显微镜(SEM),透射电子显微镜(TEM)观察了沉积态及在不同温度退火后Co/Cu多层膜表面及截面的显微组织,用能谱仪(EDS)分析了退火后Co/Cu多层膜截面的元素分布,用综合物性测量系统(PPMS)对Co/Cu多层膜的磁滞回线进行了测量。表面显微组织的观察结果表明退火温度低于450℃时,多层膜表面形貌变化不大,均是由细小的晶粒组成。退火温度高于该温度后,随退火温度的升高,晶粒迅速长大。截面显微组织的观察结果和元素分布的测试结果表明,磁控溅射的Co/Cu多层膜内有大量柱状晶,随退火温度升高柱状晶长大。当退火温度达到600℃后,多层膜内的层状结构被破坏。磁滞回线的测量结果表明,退火温度低于400℃时,Co/Cu多层膜的磁性能变化不大,退火温度高于该温度后,随退火温度升高,矫顽力迅速增大。

关键词(KeyWords)： Co/Cu多层膜;退火;微观结构;磁性能

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51171018)

作者(Author): 胡佳智,陈冷

DOI: 10.13289/j.issn.1009-6264.2015.06.003

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