刘丙金,李超君,闫焉服,任晓飞

• 1:西安航空计算技术研究所
• 2:河南科技大学材料科学与工程学院

摘要(Abstract)：

采用光学显微镜、扫描电镜及万能拉伸试验机等研究了微量稀土元素In对Zn15Al5Cu钎料的抗拉强度、伸长率和显微组织的影响。结果表明:随着In添加量增加,Zn15Al5CuxIn钎料的抗拉强度和伸长率呈现先增大后减小趋势,当In的添加量为3%时,钎料的抗拉强度和伸长率达到最大值,分别为203 MPa和5.4%,较基体钎料Zn15Al5Cu分别提高了9.7%和38.5%。当钎料中In的添加量超过3%时,In与Cu生成脆硬金属间化合物Cu_(11)In_9,导致Zn15Al5Cu钎料的抗拉强度和伸长率降低。因此,In的最佳含量应该在3%左右。

关键词(KeyWords)： In;Zn15Al5Cu钎料;抗拉强度;伸长率;金属间化合物

Abstract:

Keywords:

基金项目(Foundation): 河南省杰出青年资金资助项目(144100510002)

作者(Author): 刘丙金,李超君,闫焉服,任晓飞

DOI: 10.13289/j.issn.1009-6264.2019-0533

参考文献(References)：

• [1] 孟凡玲,吕曜晨,武小娟,等.铝硅焊丝成分对铜铝异种金属CMT焊接接头特征的影响[J].材料热处理学报,2016,37(6):95-100.MENG Fan-ling,Lü Yao-chen,WU Xiao-juan,et al.The influence of the composition of aluminum silicon welding wire on the characteristics of CMT welding joint of copper aluminum dissimilar metal[J].Transactions of Materials and Heat Treatment,2016,37(6):95-100.
• [2] 张冬冬,刘树英,陈泽,等.元素Bi及稀土La、Nd对Zn-10Al-5Cu钎料性能的影响[J].材料热处理学报,2017,38(10):52-59.ZHANG Dong-dong,LIU Shu-ying,CHEN Ze,et al.The effect of Bi and La,Nd on the properties of Zn-10Al-5Cu solder[J].Transactions of Materials and Heat Treatment,2017,38(10):52-59.
• [3] 马恒波,任柯旭,邱然锋,等.铜/铝固态界面金属间化合物的生长行为[J].材料热处理学报,2019,40(7):60-67.MA Heng-bo,REN Ke-xu,QIU Ran-feng,et al.Growth behavior of intermetallics at solid Cu/Al interface[J].Transactions of Materials and Heat Treatment,2019,40 (7):60-67.
• [4] 殷祚炷,孙凤莲.铜铝钎焊接头腐蚀机理分析[J].焊接学报,2017,38(10):121-124+134.YIN Zuo-jie,SUN Feng-lian.Analysis of corrosion mechanism of copper aluminum brazed joint[J].Transactions of the China Welding Institution,2017,38 (10):121-124+134.
• [5] 刘树英,张冬冬,谭超,等.Sb元素及稀土对Zn-10Al基钎料及钎焊接头性能影响[J].焊接学报,2018,39(8):66-71.LIU Shu-ying,ZHANG Dong-dong,TAN Chao,et al.Effect of sb and rare earth elements on properties of Zn-10Al base solder and brazed joint[J].Transactions of the China Welding Institution,2018,39 (8):66-71.
• [6] 姬峰,薛松柏,张满,等.时效对铜铝钎焊接头界面化合物和性能的影响[J].焊接学报,2012,33(5):21-24.JI Feng,XUE Song-bai,ZHANG man,et al.Effect of aging on interface compounds and properties of copper aluminum brazed joints[J].Transactions of the China Welding Institution,2012,33(5):21-24.
• [7] 张启运,庄鸿寿.钎焊手册[M].北京:机械工业出版社,2008.
• [8] 朱艳.钎焊[M].哈尔滨:哈尔滨工业大学出版社,2012.
• [9] 中国机械工程学会焊接学会.焊接手册(第2版)[M].北京:机械工业出版社,2001.
• [10] 雷世明.焊接方法与设备[M].北京:机械工业出版社,2004.
• [11] 付强.GH3030 蜂窝密封产品钎焊工艺及性能研究[D].哈尔滨:哈尔滨工业大学,2016.FU Qiang.Research on brazing process and properties of GH3030 honeycomb sealing products[D].Harbin:Harbin Institute of Technology,2016.
• [12] 谢海平,于大全,马海涛,等.Sn-Zn-Cu 无铅钎料的组织、润湿性和力学性能[J].中国有色金属学报,2004,14(10):1694-1699.XIE Hai-ping,YU Da-quan,MA Hai-tao,et al.Microstructure,wettability and mechanical properties of Sn-Zn-Cu lead-free solder[J].The Chinese Journal of Nonferrous Metals,2004,14 (10):1694-1699.
• [13] 张满,薛松柏,姬峰.CuAl2相对铜铝钎焊接头组织与性能的影响[J].焊接学报,2011,32(2):93-96.ZHANG Man,XUE Song-bai,JI Feng.Effect of CuAl2 on Microstructure and properties of brazed joints[J].Transactions of the China Welding Institution,2011,32 (2):93-96.
• [14] Kang S K,Sarkhel A K.Lead (Pb)-free solder for electronic packaging[J].Journal of Electronic Materials,1994,23(8):701-707.
• [15] Shimizu T,Ishikawa H,Ohnuma I,et al.Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use[J].Journal of Electronic Materials,1999,28(11):1172-1175.

文章评论(Comment)：