刘莹莹,王梦婷,李洁洁,张乐

• 1:西安建筑科技大学冶金工程学院

摘要(Abstract)：

采用真空电子束焊接对Ti_2AlNb和TC18合金进行连接,研究了不同焊接电流时焊接界面的性能及元素扩散情况。结果表明:焊接接头在室温和高温下均获得了较高的抗拉强度。采用同一电流焊接时,TC18侧热影响区的显微硬度值高于该合金基体却低于该侧焊缝区,而Ti_2AlNb合金侧热影响区的显微硬度值均高于该侧焊缝区和Ti_2AlNb合金基体;在28 mA的焊接电流下,焊接界面的整体显微硬度值均较高,这是因为焊接界面形成了含量较多且尺寸较小的α′马氏体和O相,对界面起到了强化作用。在不同的焊接电流下,合金元素均在焊缝和两侧母材交界处存在较大的浓度梯度,其原因是焊缝金属的快速凝固使得各合金元素没有足够的时间和能量进行充分扩散。

关键词(KeyWords)： Ti_2AlNb/TC18;电子束焊接;焊接电流;显微硬度;元素扩散

Abstract:

Keywords:

基金项目(Foundation): 陕西省国际合作与交流计划项目(2016kw-054)

作者(Author): 刘莹莹,王梦婷,李洁洁,张乐

DOI: 10.13289/j.issn.1009-6264.2019-0494

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