刘舒,谢敬佩,李继文,孙浩亮,王爱琴,马窦琴,王凤梅

• 1:河南科技大学材料科学与工程学院
• 2:郑州大学材料科学与工程学院

摘要(Abstract)：

研究了不同退火温度及退火时间对W-20%Cu复合材料微观组织、硬度、抗拉强度、导电率、密度的影响。结果表明,W-20%Cu复合材料退火温度为750~950℃,随温度升高,导电率和硬度先升高后降低;800℃与900℃分别退火0.5~6 h,导电率下降,硬度先升高后降低。800℃×0.5 h时的W-20%Cu复合材料的导电率相对较高,为47.32%IACS(国际退火铜标准),900℃×1 h时材料硬度相对较高,为285 HB。

关键词(KeyWords)： W-20%Cu复合材料;退火;导电率;硬度;机理

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51371077)

作者(Author): 刘舒,谢敬佩,李继文,孙浩亮,王爱琴,马窦琴,王凤梅

DOI: 10.13289/j.issn.1009-6264.2015.04.006

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