微量Sn添加对Al-Cu-Mg合金均匀化过程中组织演变的影响Effect of trace Sn addition on microstructure evolution of Al-Cu-Mg alloy during homogenization
李彩琼,刘浩然,王明刚,余鑫祥
摘要(Abstract):
采用光学显微镜(OM)、扫描电镜(SEM)、电子探针显微分析(EPMA)和X射线衍射(XRD)等研究了微量Sn添加对Al-Cu-Mg合金均匀化前后微观组织演变的影响,同时对合金拉伸性能进行了测试。结果表明:Al-Cu-Mg-Sn合金中初生Mg_2Sn相的形成为剩余α(Al)液相的凝固提供了异质形核点,细化了Al-Cu-Mg合金的晶粒尺寸,由约300μm减少至约150μm。一级均匀化热处理(490℃保温22 h)后,含Sn合金中虽然具有更多的Al_2Cu相残留,但可通过更高温的二级均匀化热处理(510℃保温3 h)得到有效消除,且合金中的Al_7Cu_2Fe相也得到了较大幅度的细化和球化。添加微量Sn后,合金的抗拉强度由209 MPa提升至256 MPa,断后伸长率由3%提升至5.5%。断裂方式由解理断裂为主转变为出现大量韧窝的塑性断裂。
关键词(KeyWords): Al-Cu-Mg合金;Sn;均匀化;微观组织;拉伸性能
基金项目(Foundation): 山东省自然科学基金(ZR2020ME005);; 山东省高等学校“青创科技支持计划”(2021KJ089);; 烟台市校地融合发展项目平台建设类(2020XDRHXMPT18);; 烟台南山学院青年基金(Q202015);烟台南山学院博士基金(B202006)
作者(Author): 李彩琼,刘浩然,王明刚,余鑫祥
DOI: 10.13289/j.issn.1009-6264.2022-0489
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