张永杰,董应虎,张瑞卿,任学堂,储爱民,陈德志,陈庆军,叶志国

• 1:南昌航空大学材料科学与工程学院
• 2:湖南科技大学机电工程学院

摘要(Abstract)：

通过无压熔渗法制备不同金刚石颗粒粒径的金刚石/铜复合材料,研究了金刚石颗粒体积分数及粒径对复合材料导热性能的影响。采用有限元的方法对金刚石/铜复合材料导热性能进行数值模拟,建立了二维平面四颗粒及多颗粒随机分布复合材料模型,并将数值模拟结果与参考文献试验结果进行对比,同时利用激光热导仪测试了复合材料的热导率,用以验证模型的准确性。数值模拟结果表明:复合材料热导率随金刚石颗粒体积分数及粒径的增加而增加。当金刚石颗粒体积分数小于40%时,模拟结果与实验值较为吻合,在高填充下,模拟值明显高于实验值;当金刚石颗粒粒径为82.5~110μm时,模拟值与实验值较为接近。当粒径小于66μm或大于165μm时,模拟值与实验值存在一定偏差,但整体变化趋势与实验结果保持一致。

关键词(KeyWords)： 金刚石/铜复合材料;金刚石颗粒;数值模拟;热导率

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51264033,51261021,51402146);; 江西省自然科学基金(20132BA206019,20151BAB206012);; 湖南省自然科学基金(14JJ2093);; 江西省教育厅科学技术项目(GJJ170585)

作者(Author): 张永杰,董应虎,张瑞卿,任学堂,储爱民,陈德志,陈庆军,叶志国

DOI: 10.13289/j.issn.1009-6264.2018-0017

参考文献(References)：

• [1]Yasuyukii A,Inour K.Thermal conductivity of copper composites dispersed with diamond particles prepared by spark plasma sintering[C]//The 27thJapan Symposium on Thermo-Physical Properties,Tokyo,2006:328-330.
• [2]Kidalov S V,Shakhov F M,Val A Ya.Thermal conductivity of sintered nanodiamonds and microdiamonds[J].Diamonds&Related Materials,2008(17):844-847.
• [3]Chu K,Jia C C,Liang X B,et al.Modeling the thermal conductivity of diamond reinforced aluminium matrix composites with inhomogeneous interfacial conductance[J].Materials and Design,2009(30):4311-4316.
• [4]Kang Q,He X,Ren S,et al.Effect of molybdenum carbide intermediate layers on thermal properties of copper-diamond composites[J].Journal of Alloys&Compounds,2013,576(44):380-385.
• [5]康林萍,付青峰,曹美容.金刚石体积分数对金刚石/铜复合散热材料相关性能的影响[J].热处理技术与装备,2014,35(4):10-14.KANG Lin-ping,FU Qing-feng,CAO Mei-rong.The affect of diamond volume fraction on properties of diamond/copper compound radiation material[J].Heat Treatment Technology and Equipment,2014,35(4):10-14.
• [6]郭宏,王光宗,贾成厂,等.高压熔渗金刚石/铜复合材料的低温导热特性[J].复合材料学报,2014(3):550-555.GUO Hong,WANG Guang-zong,JIA Cheng-chang,et al.Low-temperature heat conduction characteristics of diamond/Cu composite by high pressure reinfiltration[J].Acta Materiae Compositae Sinica,2014(3):550-555.
• [7]蒋潇,贺铸,高标,等.中空玻璃珠/环氧树脂复合材料导热系数的有限元模拟[J].机械工程材料,2015,39(5):93-96.JIANG Xiao,HE Zhu,GAO Biao,et al.Modeling of thermal conductivity of hollow-glass-bead/epoxy resin composite by finite element method[J].Materials for Mechanical Engineering,2015,39(5):93-96.
• [8]高智芳,刘进立,王笃金.氮化铝填充导热复合材料导热性能的有限元分析[J].塑料工业,2014,42(11):63-67GAO Zhi-fang,LIU Jin-li,WANG Du-jin.Finite element analysis of thermal conductivity of aluminum nitride filled composites[J].China Plastics lndustry,2014,42(11):63-67.
• [9]孙爱芳,刘敏珊,董其伍.石墨/PTFE复合材料导热性能的数值模拟[J].材料科学与工程学报,2007,25(3):430-433SUN Ai-fang,LIU Min-shan,DONG Qi-wu.Numerical simulation of themal conductivity of graphite/PTFE composite[J].Journal of Materials Science and Engineering,2007,25(3):430-433.
• [10]Rape A,Gott K,Kulkarni A,et al.Simulation of matrix conductivity in copper-diamond composites sintered by field assisted sintering technology[J].Computational Materials Science,2015,110:29-33.
• [11]张习敏,郭宏,尹法章,等.Cr元素对Diamond/Cu复合材料界面结构及热导性能的影响[J].稀有金属,2010,34(2):221-226.ZHANG Xi-min,GUO Hong,YIN Fa-zhang et al.Influences of Cr element on interface structures and thermal properties of Diamond/Cu Composites[J].Chinese Journal of Rare Metal,2010,34(2):221-226.
• [12]Guillemet T,Geffroy P M,Heintz J M,et al.An innovative process to fabricate copper/diamond composite films for thermal management applications[J].Composites Part A,2012,43(10):1746-1753.
• [13]任学堂.界面厚度及面积调控对Diamond-Cr/Cu复合材料导热性能的影响[D].南昌:南昌航空大学,2017.REN Xue-tang.Effect of interface thickness and interface area control on thermal conductivity of Diamond-Cr/Cu composites[D].Nanchang:Nan Chang Hangkong University,2017.
• [14]李宾,刘妍,孙斌,等.聚合物基导热复合材料的性能及导热机理[J].化工学报,2009,60(10):2650-2655.LI Bin,LIU Yan,SUN Bin,et al.Properties and heat-conduction mechanism of thermally conductive polymer composites[J].Journal of Chemical lndustry and Engineering,2009,60(10):2650-2655.

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