基于SPS工艺制备的W-25 mass%Cu复合材料的组织与性能Microstructure and properties of W-25 mass%Cu composites prepared by SPS process
段俊彪,国秀花,皇涛,宋克兴,冯江,王旭
摘要(Abstract):
采用放电等离子烧结(SPS)制备了W-25 mass%Cu复合材料,研究了烧结温度(900、950、1000、1050℃)对W-25 mass%Cu复合材料微观组织和性能的影响规律,重点研究了其耐电弧烧蚀行为。结果表明:采用SPS工艺制备的W-25 mass%Cu复合材料的组织分布均匀;随着烧结温度的升高,复合材料的致密度、导电率和硬度呈现出先增加后减小的趋势。当烧结温度为1000℃时,W-25 mass%Cu复合材料的综合性能最佳,其致密度、导电率和硬度最高,分别为96.7%、42.86%IACS和205.5 HB;压缩强度和断裂应变取得最大值,分别是875 MPa和26%。W颗粒的动力学生长行为研究结果表明晶格扩散是W颗粒长大的主导机制。在电弧烧蚀过程中,随着烧结温度的升高,W-25 mass%Cu复合材料表面的侵蚀区域先变小后增大、烧蚀坑逐渐变浅、烧蚀坑直径变宽。与900℃烧结制备的W-25 mass%Cu复合材料相比,1000℃烧结制备的W-25 mass%Cu复合材料的烧蚀坑直径扩大了47.3%,烧蚀坑深度降低了50%。
关键词(KeyWords): W-25 mass%Cu复合材料;微观组织;烧结动力学;致密度;耐电弧烧蚀性能
基金项目(Foundation): 河南省科技攻关计划项目(212102210110);; 河南省高等学校青年骨干教师培养计划项目(2018GGJS045);; 中国工程科技发展战略河南研究院战略咨询研究项目(2021HENZDA02)
作者(Author): 段俊彪,国秀花,皇涛,宋克兴,冯江,王旭
DOI: 10.13289/j.issn.1009-6264.2022-0389
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