缪宏,单翔,刘影,张剑峰,王红军

• 1:扬州大学机械工程学院
• 2:中国人民解放军理工大学
• 3:南京工业职业技术学院

摘要(Abstract)：

对真空玻璃焊料进行烧结实验,研究了封接焊料与玻璃基体的封接性能。封接焊料的热膨胀系数为9.1×10-6K~(-1),与钠钙玻璃(CET:10.2×10~(-6)K~(-1))的热膨胀系数相近;进行了不同温度下封接焊料的烧结实验,得到了PbO-TiO_2-SiO_2-R_xO_y系统封接焊料的使用温度为(460±10)℃;将烧结冷却后的样品看成浸润模型,对不同温度下封接焊料的铺展面积及润湿角进行测量,温度的升高会使封接焊料与玻璃基体表面的润湿性变好,焊料的铺展面积增大,浸润角变小;观察研究了该系统封接焊料与钠钙玻璃基体润湿后的界面结合特性,焊料与玻璃基体表面润湿后界面处会形成的过渡层带,在一定程度上利于提高封接焊料与玻璃基体连接。

关键词(KeyWords)： 真空平板玻璃;封接焊料;浸润性;界面结合

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51372216);; 国家青年科学基金(51302242);; 江苏省自然科学基金(BK2012530)

作者(Author): 缪宏,单翔,刘影,张剑峰,王红军

DOI: 10.13289/j.issn.1009-6264.2015.12.003

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