张晓辉,田保红,薛慧慧,刘勇,张毅,顾正彬,宋克兴

• 1:河南科技大学材料科学与工程学院
• 2:有色金属共性技术河南省协同创新中心
• 3:河南省有色金属材料科学与加工技术重点实验室
• 4:南京大学材料科学与工程系

摘要(Abstract)：

以用球磨混粉和冷冻干燥工艺制备的氧化石墨烯(GO)、铜铝合金粉、钨粉、铬粉和氧化亚铜粉的混合粉体为原料,利用真空热压烧结-内氧化法制备了0.3GO/Al_2O_3-Cu/(35)W(5)Cr和0.5GO/Al_2O_3-Cu/(35)W(5)Cr两种触头材料,并分别测试了其导电率、布氏硬度和致密度;利用场发射扫描电镜和透射电镜分析了触头材料的微观组织;并研究了两种触头材料的电接触性能和拉伸性能。结果表明:纳米氧化铝颗粒弥散分布在铜基体中并钉扎位错;氧化石墨烯失去部分官能团转变为还原氧化石墨烯,掺杂后触头材料导电率有所提高。少量C原子与Cr结合原位生成的Cr_3C_2对触头材料起到了强化作用;在电弧侵蚀过程中两种触头材料最终的质量转移方向都是从阴极转移到阳极,电弧侵蚀后阳极形成了凸起,阴极留下了灼坑;和Al_2O_3-Cu/(35)W(5)Cr触头相比,含有0.3 mass%GO和0.5 mass%GO的两种触头材料烧结态的抗拉强度分别提高了45%和34%,还原氧化石墨烯对基体的强化作用明显。

关键词(KeyWords)： 氧化石墨烯;热压烧结;电弧侵蚀;材料转移;抗拉强度

Abstract:

Keywords:

基金项目(Foundation): 河南省科技开放合作项目(182106000018);; 国家自然科学基金(U1704143)

作者(Author): 张晓辉,田保红,薛慧慧,刘勇,张毅,顾正彬,宋克兴

DOI: 10.13289/j.issn.1009-6264.2019-0089

参考文献(References)：

• [1] 荣命哲.电接触理论[M].北京:机械工业出版社,2004:1-5.
• [2] 陈文革,黎斌.CuW触头材料的制备及失效分析[J].电工材料,2010(4):9-14.CHEN Wen-ge,LI Bin.Fabrication and failure analysis of CuW compisite contact materials[J].Electrical Engineering Materials,2010(4):9-14.
• [3] 吴彩霞,方敏,余贤旺,等.纳米CuCr触头材料研究进展[J].电工材料,2017(6):30-35.WU Cai-xia,FANG Min,YU Xian-wang,et al.Research process in the nano CuCr contact materials[J].Electrical Engineering Materials,2017(6):30-35.
• [4] Tian B H,Liu P,Song K X,et al.Microstructure and properties at elevated temperature of a nano-Al2O3 particles dispersion-strengthened copper base composite[J].Material Science and Engineering A,2006,435-436:705-710.
• [5] 范景莲,严德剑,黄伯云,等.国内外钨铜复合材料的研究现状[J].粉末冶金工业,2003,13(2):9-14.FAN Jing-lian,YAN De-jian,HUANG Bo-yun,et al.Current study of R&D of W-Cu composite materials in China and abroad[J].Powder Metallurgy Industry,2003,13(2):9-14.
• [6] 冼爱平.大功率真空开关铜铬触头材料[J].中国有色金属学报,2001,11(5):731-740.XIAN Ai-ping.Cu-Cr contact material for high power vacuum interrupters[J].The Chinese Journal of Nonferrous Metals,2001,11(5):731-740.
• [7] Tang Y X,Yang X M,Wang R R,et al.Enhancement of the mechanical properties of graphene-Cu composites with graphene-nickel hybrids[J].Materials Science and Engineering A,2014,599:247-254.
• [8] Varol T,Canakci A.Microstructure,electrical conductivity and hardness of multilayer graphene/copper nanocomposites synthesized by flake powder metallurgy[J].Metals and Materials International,2015,21(4):704-712.
• [9] 董龙龙.掺杂石墨烯钨铜复合材料组织性能的研究[D].西安:西安理工大学,2017:51-59.DONG Long-long.Research on microstructure and properties of W-Cu composite materials doped with graphene[D].Xi'an:Xi'an University of Technology,2017:51-59.
• [10] 洪起虎,燕绍九,杨程,等.氧化石墨烯/铜基复合材料的微观结构和力学性能[J].材料工程,2016,44(9):1-7.HONG Qi-hu,YAN Shao-jiu,YANG Cheng,et al.Microstructure and mechanical properties of graphene oxide/copper composites[J].Journal of Materials Engineering,2016,44(9):1-7.
• [11] 李多生,吴文政,QIN Qing-hua,等.石墨烯/Al复合材料的微观结构及力学性能[J].中国有色金属学报,2015,25(6):1498-1504.LI Duo-sheng,WU Wen-zheng,QIN Qing-hua,et al.Microstructure and mechanical properties of graphene/Al composites[J].The Chinese Journal of Nonferrous Metals,2015,25(6):1498-1504.
• [12] 艾拉特·M.迪米夫,齐格弗里德·艾格勒.氧化石墨烯基本原理与应用[M].张强强,何平鸽,俞袆康,等译.北京:机械工业出版社,2018:182-190.
• [13] Ramirez C,Garzon L,Miranzo P,et al.Electrical conductivity maps in graphene nanoplatelet/silicon nitride composites using conducting scanning force microscopy[J].Carbon,2011,49(12):3873-3880.
• [14] 崔烨.石墨烯/铜基复合粉体的制备及其复合材料的组织和性能[D].哈尔滨:哈尔滨工业大学,2015:35-40.CUI Ye.Preparation of graphene/copper composite powders and structure and properties of composites[D].Harbin:Harbin Institute of Technology,2015:35-40.
• [15] 陶麒鹦,周晓龙,周允红,等.AgCuO电触头材料的电接触性能[J].中国有色金属学报,2015,25(5):1244-1249.TAO Qi-ying,ZHOU Xiao-long,ZHOU Yun-hong,et al.Electrical contact properties of AgCuO electrical contact materials[J].The Chinese Journal of Nonferrous Metals,2015,25(5):1244-1249.
• [16] 陈文革,陈勉之,邢力谦,等.掺杂对WCu电触头材料电弧特性的影响[J].中国有色金属学报,2009,19(11):2029-2037.CHEN Wen-ge,CHEN Mian-zhi,XING Li-qian,et al.Effect of doping on electrical arc characteristic of WCu electrical contact materials[J].The Chinese Journal of Nonferrous Metals,2009,19(11):2029-2037.
• [17] Zhang X,Zhang Y,Tian B,et al.Arc erosion behavior of the Al2O3-Cu/(W,Cr) electrical contacts[J].Composites Part B,2019(160):110-118.
• [18] 荣命哲,赵志远,杨武.低压电器中电触头材料的转移[J].低压电器,1998,5:16-18.RONG Ming-zhe,ZHAO Zhi-yuan,YANG Wu.Contact material transfer of low voltage apparatus[J].Low Voltage Apparatus,1998,5:16-18.
• [19] 李震彪,徐金玲,黄良,等.电磁继电器触点动熔焊机理分析[J].低压电器,2007,5:1-3.LI Zhen-biao,XU Jin-ling,HUANG Ling,et al.Mechanism analysis on dynamic welding of electromagnetic relay contacts[J].Low Voltage Apparatus,2007,5:1-3.
• [20] 刘向军.开关电器触头熔焊机理分析[J].低压电器,2006,9:11-14.LIU Xiang-jun.Analysis of welding mechanism on electrical contact of switches[J].Low Voltage Apparatus,2006,9:11-14.
• [21] Chu K,Jia C,Jiang L,et al.Improvement of interface and mechanical properties in carbon nanotube reinforced Cu-Cr matrix composites[J].Materials and Design,2013,45:407-411.

文章评论(Comment)：