程韬,贾建刚,马勤,季根顺,郭铁明

• 1:兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室
• 2:兰州理工大学有色金属合金省部共建教育部重点实验室

摘要(Abstract)：

采用X射线衍射仪(XRD)和扫面电子显微镜(SEM)研究了短碳纤维表面镀铜层的物相及镀铜层的生长过程,分析了电沉积镀铜机理,优化了其工艺。结果表明,当镀铜电压为1 V时,Cu在碳纤维表面择优位置形核,形核率和长大速度较低,沉积30 min碳纤维表面形成的Cu镀层不完整;1.5 V时沉积30 min的Cu镀层完整性较1 V时明显改善,电压为2 V时沉积30 min可以得到均匀的镀层;当电压为2.5 V时,Cu镀层生长速度显著加快,镀层易脱落。

关键词(KeyWords)： 短碳纤维;电沉积;镀铜;增强体

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金青年基金项目(51001057);; 兰州理工大学红柳青年教师培养计划(201203)

作者(Author): 程韬,贾建刚,马勤,季根顺,郭铁明

DOI: 10.13289/j.issn.1009-6264.2014.09.033

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