任广笑,王红霞,周斌,刘一鸣,王斌兵

• 1:太原理工大学材料科学与工程学院
• 2:山西省先进镁基材料重点实验室
• 3:太原市精诚镁合金科技有限公司

摘要(Abstract)：

在573 K,通过等通道转角挤压成功制备了7075Al/AZ31复合板,并采用SEM、EDS、XRD和剪切实验研究了挤压道次及退火温度对复合板界面层组织和性能的影响及剪切断裂面的组成。结果表明:1道次等通道转角挤压制备的复合板界面处形成厚度为20μm均匀致密的扩散层,由Al_3Mg_2相和Mg_(17)Al_(12)相组成,Al_3Mg_2相层厚(17μm)是Mg_(17)Al_(12)相层厚(3μm)的5.6倍。2道次等通道挤压后,扩散层厚度无变化,但是出现了裂纹,剪切强度大幅下降,剪切断裂面发生在Al_3Mg_2相层。复合板界面层在473 K退火,扩散层厚度无变化,裂纹无改善,剪切强度略有提高;573 K退火,复合板扩散层中的Al_3Mg_2相层和β-Mg_(17)Al_(12)相层均急剧增厚,微裂纹被焊合,剪切强度均大幅下降。在相同处理状态下,1道次ECAP复合板剪切强度均高于2道次ECAP复合板,473 K退火处理后,强度高出30.11%。573 K退火处理后,强度高出12.4%。故利用等通道转角挤压法制备7075Al/AZ31复合板,1道次比较合适,扩散层退火温度不宜超过473 K。

关键词(KeyWords)： 复合板;等通道转角挤压;界面微观组织;结合强度

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51301118);; 山西省国际合作项目(2014081002);; 山西省高等学校科技创新项目(2013108)

作者(Author): 任广笑,王红霞,周斌,刘一鸣,王斌兵

DOI: 10.13289/j.issn.1009-6264.2016.05.007

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