郝红梅,武志红,贾书君,李拔,刘清友

• 1:西安建筑科技大学材料与矿资学院
• 2:钢铁研究总院工程用钢研究所

摘要(Abstract)：

采用光学显微镜、扫描电镜、能谱仪、X-射线衍射仪、显微硬度计及拉剪试验研究了退火温度对N08825/X52爆炸复合板界面组织和性能的影响。结果表明:随着退火温度的升高,界面X52侧显微组织逐渐发生回复再结晶;到580℃左右,界面X52侧组织开始发生再结晶,界面的硬化现象消失,界面附近显微硬度降到与X52基体同一水平。与热处理前相比,热处理后剪切强度降低缓慢。当退火温度小于580℃时,扩散层的γ-(Fe,Ni)固溶强化及结合区的塑性变形强化,导致界面结合强度较高,剪切试样全部在界面附近的X52基体处发生断裂,因此剪切强度基本未变;当加热温度高于580℃时,固溶强化幅度小于加工硬化消失引起的强度降低幅度,导致界面结合强度降低且剪切试样在波形结合界面处断裂。

关键词(KeyWords)： 爆炸焊接;N08825/X52复合板;退火;界面;力学性能

Abstract:

Keywords:

基金项目(Foundation): 国家科技支撑计划(2011BAE25B00)

作者(Author): 郝红梅,武志红,贾书君,李拔,刘清友

DOI: 10.13289/j.issn.1009-6264.2016.04.020

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