吴海华,康怡,刘智,钟强,魏恒,郝佳欢,戢运鑫

• 1:三峡大学机械与动力学院
• 2:石墨增材制造技术与装备湖北省工程研究中心

摘要(Abstract)：

采用选择性激光烧结(SLS)、浸渍致密化和液相熔融渗硅法制备了石墨碳化硅复合高温熔盐封装材料。利用扫描电镜(SEM)、X射线衍射(XRD)、万能试验机和导热系数测试仪等研究了封装材料的微观形貌、相组成、抗压强度和导热系数。结果表明：材料配方中加入高纯硅粉会发生原位烧结反应生成碳化硅增强相，填补封装材料内部孔隙，并提升了其抗压强度和导热系数；对高纯硅粉进行包覆处理能够加剧这一反应，高纯硅粉加入量为20 mass%时，性能提升幅度最大。在此基础上加入20 mass%中间相碳微球能够最大地提升封装材料的抗压强度和导热系数，并降低气孔率。经石墨化处理和液相熔融渗硅处理后封装材料表层致密且性能最佳，抗压强度达到30.328 MPa,导热系数达到103.582 W/(m·K),整体开气孔率下降至8.43%,能够实现对高温熔盐的封装和换热强化。

关键词(KeyWords)： 石墨/碳化硅封装材料;高温熔盐;选择性激光烧结;抗压强度;导热系数;气孔率

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51575313)

作者(Author): 吴海华,康怡,刘智,钟强,魏恒,郝佳欢,戢运鑫

DOI: 10.13289/j.issn.1009-6264.2023-0053

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