李勇,易丹青,柳瑞清

• 1:中南大学材料科学与工程学院
• 2:国家铜冶炼及加工工程技术研究中心

摘要(Abstract)：

研究了时效对Cu-0.15Ag-0.1Fe合金的显微硬度、抗拉强度和电导率的影响。结果表明:随着时效时间的增加和时效温度的升高,Cu-0.15Ag-0.1Fe合金的显微硬度和抗拉强度先急剧增加随后逐渐降低;合金经960℃×1 h固溶,在500℃时效2 h后可获得较好的显微硬度和抗拉强度,分别为124 HV和442 MPa;当时效时间增加到6 h,可获得较高的电导率,达到82.5%IACS。通过透射显微镜分析,该合金中的强化相是γ-Fe粒子,与以前报道的Cu-Fe系合金的析出强化相是α-Fe不同。

关键词(KeyWords)： Cu-Ag-Fe合金;时效;抗拉强度;电导率

Abstract:

Keywords:

基金项目(Foundation): 江西理工大学工程研究院创新基金项目(JUST.GCY-2010-02)

作者(Author): 李勇,易丹青,柳瑞清

DOI: 10.13289/j.issn.1009-6264.2011.09.018

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