王庆娟,张平平,杜忠泽,王静怡

• 1:西安建筑科技大学冶金工程学院

摘要(Abstract)：

室温下采用等径弯曲通道变形(Equal Channel Angular Pressing,ECAP)C方式进行了纯铜(99.95%)12道次挤压变形。通过等温和等时退火,研究ECAP变形后铜的退火行为,并研究了等径弯曲通道变形和退火后纯铜的显微硬度和显微结构变化。分析了ECAP应变量、退火时间和退火温度对超细晶铜的再结晶行为、抗软化性能的影响。结果表明:ECAP变形后的超细晶铜在退火过程中,表现出不连续再结晶现象;ECAP降低了铜的热稳定性,变形道次越高再结晶温度越低。退火后稳态晶粒尺寸随变形道次的增加而细化,硬度值随变形道次的增加而增大,回归分析表明,晶粒尺寸与硬度之间的关系符合Hall-Petch公式。

关键词(KeyWords)： 等径弯曲通道;超细晶铜;退火;热稳定性

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金项目(51104113);; 陕西省教育厅科研计划项目(2010JK650)

作者(Author): 王庆娟,张平平,杜忠泽,王静怡

DOI: 10.13289/j.issn.1009-6264.2012.08.020

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