吴茂,曹车正,王越,陈晓玮,何新波,曲选辉

• 1:北京科技大学新金属材料国家重点实验室
• 2:北京市先进粉末冶金材料与技术重点实验室

摘要(Abstract)：

采用97(72Ag-28Cu)-3Ti活性钎料钎焊了Diamond/Cu复合材料和Al2O3陶瓷,研究了主要钎焊条件如钎焊温度和保温时间对接头强度的影响。结果表明,钎焊过程中Ti元素易聚集在金刚石颗粒周围并形成TiC化合物层。TiC化合物的形貌与Diamond/Cu钎焊接头剪切强度有密切关系,金刚石表面生长适当厚度的TiC化合物层能增强钎焊接头的剪切强度,但如果TiC为颗粒状或TiC化合物层生长过厚,将削弱钎焊接头的剪切强度。钎焊接头的最大剪切强度可达117 MPa。

关键词(KeyWords)： diamond/Cu复合材料;Ag-Cu-Ti钎料;活性钎焊;剪切强度

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51204016);; 高等学校博士学科点专项科研基金(20120006120011);; 中央高校基本科研业务费专项资金(FRF-TP-12-154A);; 国家博士后科学基金(11175020)

作者(Author): 吴茂,曹车正,王越,陈晓玮,何新波,曲选辉

DOI: 10.13289/j.issn.1009-6264.2013.03.029

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