李艳霞,刘俊友,刘国权,贾琪瑾

• 1:北京科技大学材料科学与工程学院
• 2:北华航天工业学院材料系

摘要(Abstract)：

采用液固分离法制备了Al-65vol%Si电子封装材料,借助扫描电镜、透射电镜等手段分析了合金中Si相的形态分布、界面及断口形貌,测定了合金的热膨胀系数、热导率及抗弯强度。结果表明:Al-65vol%Si合金组织中硅相颗粒分布均匀,形状规则呈近团球状和短杆状,Al/Si两相界面光滑、平直,无缺陷。合金密度2.4 g/cm3,室温下的热导率(TC)为119.5 W/(m.K),热膨胀系数(CTE)从50℃到400℃在6.5×10-6～11.3×10-6/K范围内稳定增加,抗弯强度为132 MPa,Si相的脆性断裂为主要断裂方式。Al-65vol%Si合金性能满足电子封装要求。

关键词(KeyWords)： 液固分离;高硅铝合金;电子封装;热导率;热膨胀系数

Abstract:

Keywords:

基金项目(Foundation):

作者(Author): 李艳霞,刘俊友,刘国权,贾琪瑾

DOI: 10.13289/j.issn.1009-6264.2012.03.002

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