浸镀温度对溶剂法热镀Galfan合金界面层组织的影响Effect of hot-dipping temperature on microstructure of interface layer of galfan alloy coating by solvent method
王雅伟,杜安,马瑞娜,范永哲,赵雪,刘彤,曹晓明
摘要(Abstract):
采用溶剂法在430~530℃分别在Q235钢基体上制备了热镀Galfan合金镀层,运用扫描电镜、X射线衍射仪分析了浸镀温度对合金镀层界面组织的影响。结果表明:浸镀温度为430~450℃时,界面层生长速度缓慢;当温度高于470℃时,界面层生长速度变快,高温时界面层的生长速度为低温界面层生长速度的2倍。浸镀温度为430~450℃时,界面层分为两层,远离基体部分为圆片状组织,尺寸为1~3μm;靠近基体部分为椭球状组织,尺寸约为几百纳米。浸镀温度为470~530℃时,界面层全部为椭球状组织,尺寸为3~6μm。其中圆片状组织为FeAl_3相,椭球状组织为Fe_2Al_5Zn_(0.4)组成。随着浸镀温度的提高,界面层组织晶粒逐渐变大。
关键词(KeyWords): 热浸镀;界面层;溶剂法;热浸镀温度
基金项目(Foundation): 国家自然科学基金(51501055,51601056);; 河北教育厅项目(Z2013048)
作者(Author): 王雅伟,杜安,马瑞娜,范永哲,赵雪,刘彤,曹晓明
DOI: 10.13289/j.issn.1009-6264.2017.04.025
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