Ni-Cr-Mo-Cu合金的固溶处理及其对耐蚀性的影响Solution treatment and its effects on corrosion resistance of Ni-Cr-Mo-Cu alloy
杨瑞成,王凯旋,吕学飞
摘要(Abstract)：
基于扩散理论运用和具体分析,本工作对于所研制的Ni-Cr-Mo-Cu铸态合金的固溶处理工艺及其对成分、组织和腐蚀抗力的影响进行了试验研究。结果表明:手工电弧熔炼、真空感应熔炼和真空白耗电极熔炼的铸态组织有明显区别,分别为较细的胞状或网络状结构(其胞尺寸约20μm)、粗大的树枝晶(其枝晶间距80～100μm)和发达的方向性树枝晶组织(间距为60～80μm)。经1140～1170℃、2.5h的固溶处理后,上述胞状或枝晶组织消失、偏析组织达到均匀化。与铸态合金相比,固溶状态的合金在4种介质(50%HNO_3、30%HCl、15%FeCl_3和混合酸)中的耐蚀性都获得提高(15%～25%以上)。
关键词(KeyWords)： 镍基耐蚀合金;枝晶;固溶处理;耐蚀性;扩散
基金项目(Foundation): 甘肃省有色金属新材料重点实验室基金(SKL05011)
作者(Author): 杨瑞成,王凯旋,吕学飞
参考文献(References)：
- [1]杨瑞成．高性能镍基耐蚀合金的特性与研究动向[J]．材料导报，2001，15(11)：21-23．YANG Rui-cheng.Characteristics and research trends of high performance Ni-base corrosion resistant alloys[J].Material s Review,2001,15 (11):21-23.
- [2]Rebak R B.Nickel alloys for corrosive environments[J].Advanced Materials and Processes.2000,157(2):37-42.
- [3]Herda W R.Evolutionary development in Ni alloys and stainless steel metallurgy for meeting the industry,corrosive challenges:the last 50 years[J].Stainless steel 99,2:117-125.
- [4]Birn J.Corrosion behavior of high Ni and Cr alloys in natural Baltic seawater[J].Corrosion.1999,55(10):977-983.
- [5]Veda M.Application of corrosion resistance Ni-base alloys for sour service[J].Eurrcorr'99,55(2):278-284.
- [6]Brandl W.Corrosion behavior of high alloyed steels and base alloy in acetic acid/acetic anhydride solutions[J].Eurocorr'99,55(2):125-132.
- [7]Ezugwu.E.O.The machinability of nickel-based alloys:a review[J].Journal of Materials Processing Technology,1999,(86):1-16.
- [8]Stephen E.Z.Corrosion behavior of NiCrMo Alloy 625 in high temperature,hydrogenated water[J].Corrosion Science.2003,45(9):1595-1618.
- [9]Xu Jiang,Xishan Xie,Zhong Xu,et.al.Investigation on multi-element Ni-Cr-Mo-Cu alloying layer by double glow plasma alloying technique[J].Materials Chemistry and Physics.2005,92(3):340-347.
- [10]王凯旋，杨瑞成．通用性镍基耐蚀合金的研制[J]．兰州理工大学学报2005，31(6)：28-31．WANG Kai-xuan;YANG Rui-cheng.Development of versatile Ni-base corrosion resistant alloy[J].Journal of Lanzhou University of Technology,2005,31(6):28-31
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