李艳丽,许壮,张雪娜,李晓娜,孔祥东,韩立

• 1:中国科学院电工研究所电子束曝光技术研究组
• 2:中国科学院大学
• 3:兰州大学物理科学与技术学院

摘要(Abstract)：

利用ANSYS软件模拟电子束退火MgB_2薄膜过程的温度场分布,退火样品与样品台之间的接触热阻对退火温度影响很大,且此接触热阻会随退火参数(电子束能量和退火时间)发生变化,这给模拟工作带来很大困难。本文先通过热阻串联对样品进行等效简化,再利用热传导近似计算把接触热阻的效应等效在样品模型中,并将接触热阻随退火参数的变化转化为电子束能量转化效率的变化,得到修正后的热源模型,仿真所得温度值与实测温度值基本相符,这为电子束退火制备薄膜材料的研究提供了温度参考。

关键词(KeyWords)： ANSYS;电子束退火;薄膜;温度场;模拟

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51177160,51307162)

作者(Author): 李艳丽,许壮,张雪娜,李晓娜,孔祥东,韩立

DOI: 10.13289/j.issn.1009-6264.2017.02.028

参考文献(References)：

• [1]戴倩.电子束退火法制备Mg B2超导薄膜和Mg B2超薄膜的制备[D].北京:北京大学,2013.DAI Qian.Fabrication Mg B2thin film by electron-beam annealing method and the preparation of ultra thin Mg B2film[D].Beijing:Peking University,2013.
• [2]许壮.电子束退火制备Mg B2超导薄膜和Mg B2约瑟夫森结[D].兰州:兰州大学,2014.XU Zhuang.The preparation of Mg B2superconducting thin films and Mg B2Josephson junction by electron beam annealing[D].Lanzhou:Lanzhou University,2014.
• [3]郭绍庆,李晓红,毛唯,等.GH909电子束焊接温度场的有限元分析[J].航空材料学报,2000,20(3):98-101.GUO Shao-qing,LI Xiao-hong,MAO Wei,et al.Finite element analysis of temperature fields in electron beam welding of alloy GH909[J].Journal of Aeronautical Materials,2000,20(3):98-101.
• [4]ZHANG Wei,XIAO Pan,CHEN Zhuo.Temperature field simulation of pulsed electron beam welding on 304 stainless steel[J].Rare Metal Materials and Engineering,2013,42(S2):33-37.
• [5]陈云霞,朱妙凤,芦凤桂,等.电子束快速成形温度场模拟[J].焊接学报,2009,30(4):33-37.CHEN Yun-xia,ZHU Miao-feng,LU Feng-gui,et al.The temperature field simulation of electron beam rapid prototyping[J].Transactions of the China Welding Institution,2009,30(4):33-37.
• [6]朱妙凤.电子束快速成型及其温度场模拟[D].上海:上海交通大学,2008.ZHU Miao-feng.Electron beam rapid prototyping and its temperature field simulation[D].Shanghai:Shanghai Jiao Tong University,2008.
• [7]王荣,沈国斌,魏德强.6061铝合金电子束表面处理温度场的仿真与实验验证[J].材料热处理学报,2012,33(11):158-162.WANG Rong,SHEN Guo-bin,WEI De-qiang.Numerical simulation and experimental verification of temperature field for 6061 aluminum alloy surface modification by electron beam[J].Transactions of Materials and Heat Treatment,2012,33(11):158-162.
• [8]Shiomi M,Yoshidome A,Abe F,et al.Finite element analysis of melting and solidifying processes in laser rapid prototyping of metallic powders[J].International Journal of Machine Tools&Manufacture,1999,39(2):237-252.
• [9]Costa L,Vilar R,Reti T,et al.Rapid tooling by laser powder deposition:process simulation using finite element analysis[J].Acta Materialia,2005,53(14):3987-3999.
• [10]杨世铭,陶文铨.传热学[M].北京:高等教育出版社,2006.YANG Shi-ming,TAO Wenshuan.Heat Transfer[M].Beijing:Higher Education Press,2006.

文章评论(Comment)：