曹飞,陶迪,李义全,李韶林,曹军,宋克兴,姜伊辉

• 1:西安理工大学材料科学与工程学院
• 2:导电材料与复合技术教育部工程研究中心
• 3:陕西省电工材料熔(浸)渗技术重点实验室
• 4:河南科技大学材料科学与工程学院

摘要(Abstract)：

随着微电子器件微型化与高密度集成化的快速发展，高性能铜基微细丝凭借优异的传导性能被广泛应用于集成电路引线键合。然而，铜基键合线在存储以及服役过程中易受环境中的氧侵蚀形成Cu_2O/CuO氧化层，导致界面接触电阻升高，严重影响电子元器件的使用寿命和稳定性。本文从导电性能优化、导电机理研究、抗氧化性能实验研究、改善抗氧化性能方法以及抗氧化机理等方面综述了铜及铜合金的导电性能和抗氧化性能的研究进展。基于铜及铜合金成分设计、加工工艺改善抗氧性能和导电性能对比分析，提出了当前存在的问题，展望了利用微量稀土元素与涂镀工艺协同提升铜及铜合金微细丝抗氧性能与导电性能的应用发展前景。

关键词(KeyWords)： 铜及铜合金;微合金化;导电性能;抗氧化性能

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(U21A2051,52322409);; 中央引导地方科技发展资金(2024ZY-JCYJ-04-08)

作者(Author): 曹飞,陶迪,李义全,李韶林,曹军,宋克兴,姜伊辉

DOI: 10.13289/j.issn.1009-6264.2025-0051

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