曹军,吴卫星,张灿,花涵,徐旭

• 1:河南理工大学机械与动力工程学院
• 2:郑州大学材料科学与工程学院

摘要(Abstract)：

利用扫描电镜、强度测试仪及电阻电桥对Ag-4Pd合金线在热处理过程中的性能与显微组织变化进行研究,分析不同热处理温度对Ag-4Pd合金线电学性能、力学性能和组织结构的影响。结果表明:随着热处理温度的增加,?0.06 mm的Ag-4Pd合金线拉断力降低,伸长率增加,电阻值降低后趋于平稳;热处理温度为500℃时,合金线具有较好的综合性能,此时米电阻为6.71Ω,拉断力为51.17 g,伸长率为26.73%;其显微组织形态在400℃以下热处理时呈复合纤维状,再结晶温度为450℃;继续增加热处理温度至550℃,出现了晶粒以相互吞并方式长大的孪晶组织。

关键词(KeyWords)： Ag-4Pd合金线;热处理;电学性能;力学性能;组织结构

Abstract:

Keywords:

基金项目(Foundation): 河南省科技攻关计划项目“半导体器件键合用Ag/Pd/Au合金线开发”(152102210313)

作者(Author): 曹军,吴卫星,张灿,花涵,徐旭

DOI: 10.13289/j.issn.1009-6264.2018-0101

参考文献(References)：

• [1]Liu P,Tong L,Wang J,et al.Challenges and developments of copper wire bonding technology[J].Microelectronics Reliability,2012,52(6):1092-1098.
• [2]Uno T.Enhancing bondability with coated copper bonding wire[J].Microelectronics Reliability,2011,51(1):88-96.
• [3]Hsueh H W,Hung F Y,Lui T S,et al.Microstructure electric flame off(EFO)characteristics and tensile properties of silverlanthanum alloy wire[J].Microelectronic Reliability 2014;54(11):2564-2569.
• [4]Ramos A S,Vieira M T.Intermetallic compound formation in Pd/Al multilayer thin films[J].Intermetallics,2012,25(3):70-74.
• [5]曹军,吴卫星.微电子封装银合金键合线的研究及发展前景[J].贵金属,2017,38(S1):7-11.CAO Jun,WU Wei-xing.Research and development prospect of Ag alloy bonding wire in microelectronic packaging[J].Precious Metals,2017,38(S1):7-11.
• [6]Kumar S,Heo Y I L,Kim S,et al.Thermosonic ball bonding behavior of Ag-Au-Pd alloy wire[C].IEEE Electronics Packaging Technology Conference,2013:15-20
• [7]Zeng Y Z,Ke W B,Hong M J.Thermodynamic study on the corrosion mechanism of copper wire bonding[J].Microelectronics Reliability,2013,53(7):985-1001.
• [8]Tseng Y W,Hung F Y,Lui T S.Microstructure,tensile and electrical properties of gold-coated silver bonding wire[J].Microelectronics Reliability,2015,55(3):608-612.
• [9]Hang C J,Tian H Y,et al.High temperature storage reliability of Cu bonds by ultrasonic bonding with fine copper wire[J].Transactions of the china welding institution,2013,34(2):13-16.
• [10]Breach C D,Wulff F,Tok C W.An unusual mechanical failure mode in gold ball bonds at 50μm pitch due to degradation at the Au-Au4 Al interface during ageing in air at 175℃[J].Microelectronics Reliability,2006,46(1):543-557.
• [11]Lia B H,Yea J T,Liao J K,et al.Effect of pretreatments on the metal-ceramic bonding strength of a Pd-Ag alloy[J].Journal of Dentistry,2014,42(3):319-328.
• [12]Li J H,Liu L G,Ma B K,et al.Dynamics features of Cu-wire bonding during overhang bonding process[J].IEEE Electron Device Letters,2011,32(12):1731-1733.
• [13]Zhong Z W,Ho H M,Tan Y C,et al.Study of factors affecting the hardness of ball bonds in copper wire bonding[J].Microelectronic Engineering,2007,84(2):368-384.
• [14]Chuang T H,Wang H C,Tsai C H,et al.Thermal stability of grain structure and material properties in an heat treatment-twinned Ag-8Au-3Pd alloy wire[J].Scripta Materialia,2012,67(6):605-608.
• [15]Guo R,Hang T,Mao D,et al.Behavior of intermetallics formation and evolution in Ag-8Au-3Pd alloy wire bonds[J].Journal of Alloys and Compounds,2014,588(9):622-627.
• [16]Chuang T H,Wang H C,Tsai C H,et al.Thermal stability of grain structure and material properties in an heat treatment twinned Ag-4Pd alloy wire[J].Journal of Alloys and Compounds,2014,615:891-898.
• [17]Guo R,Gao L,Mao D,et al.Study of free air ball formation in Ag-8Au-3Pd alloy wire bonding[J].Microelectronics Reliability,2014,54(11):2550-2554.
• [18]Du Y,Liu Z,Xiong T,et al.Bond reliability under humid environment for Pd coated Cu and Ag alloy wire bonding[C]//Electronic Packaging Technology(ICEPT),2015 16th International Conference on,IEEE,2015:835-839.
• [19]Tseng Y W,Hung F Y,Lui T S,et al.Effect of heat treatment on the microstructure and bonding interface properties of Ag-2Pd alloy wire[J].Microelectronics Reliability,2015,55(8):1256-1261.
• [20]曹军,范俊玲,高文斌.不同模具参数对极细Ag-Pd键合合金线拉制质量的影响[J].热加工工艺,2016,37(17):39-42.CAO Jun,FAN Jun-ling,GAO Wen-bin.Effects of different die parameters on fine Ag-Pd bonding wire drawing quality[J].Hot Working Technology,2016,37(17):39-42.

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