纯钼双道次热变形行为Double-pass hot deformation behavior of pure molybdenum
张琦飞,王爱琴,谢敬佩,陈艳芳,郭惠丹
摘要(Abstract):
利用Gleeble-1500D热模拟机,对粉末冶金法制备的纯钼板坯在变形温度分别为1060、1140、1220和1300℃,应变速率为0. 01 s-1,真应变分别为0. 2和0. 3的条件下进行双道次热压缩变形试验,采用光学显微镜观察了纯钼热变形后的微观组织,绘制其高温热变形真应力-真应变(σ-ε)关系曲线,采用0. 2%应力补偿法计算了其再结晶软化比,分析了纯钼的热变形软化行为和微观组织变化规律。结果表明:纯钼在高温(1220~1300℃)时易发生再结晶软化;真应变ε=0. 3时,第二道次热压变形过程中纯钼在各温度下均发生了动态再结晶,1220℃变形时再结晶程度最大,晶粒尺寸相对均匀,当变形温度达到1300℃时,发生了明显的动态再结晶,双道次热变形后,再结晶晶粒长大。
关键词(KeyWords): 纯钼;热变形;静态再结晶;软化比;微观组织
基金项目(Foundation): 河南省教育厅项目(17A430018)
作者(Author): 张琦飞,王爱琴,谢敬佩,陈艳芳,郭惠丹
DOI: 10.13289/j.issn.1009-6264.2019-0162
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