曹韩学,贾从波,唐浩兴,姜浩,李莉

• 1:重庆大学材料科学与工程学院
• 2:重庆大学国家镁合金材料工程技术研究中心

摘要(Abstract)：

将真空压铸(50%真空度)Al-Si-Cu合金试样在500℃固溶处理0.5、2、4和6 h以及进行500℃×4 h+530℃×6 h的固溶处理,利用光学显微镜和扫描电镜研究了真空压铸对Al-Si-Cu合金固溶处理过程表面起泡的影响。结果表明:相对于普通压铸,真空压铸试样基体更致密、内部气孔小且分散,固溶处理过程中起泡核心长大需要较长时间,表面起泡小于100μm的条件下,在500℃可固溶处理2 h;起泡核心距离表面越远、核心尺寸越小以及表面致密度、强度越高,表面起泡所需要的时间也越长。

关键词(KeyWords)： 真空压铸;表面起泡;固溶处理;Al-Si-Cu合金;气孔

Abstract:

Keywords:

基金项目(Foundation): 中央高校基本科研业务费(CDJZR12130050)

作者(Author): 曹韩学,贾从波,唐浩兴,姜浩,李莉

DOI: 10.13289/j.issn.1009-6264.2016.02.004

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