程从前,赵杰,杨朋,朱凤

• 1:大连理工大学三束材料改性国家重点实验室大连理工大学材料科学与工程学院
• 2:大连理工大学三束材料改性国家重点实验室大连理工大学材料科学与工程学院
• 3:大连理工大学三束材料改性国家重点实验室大连理工大学材料科学与工程学院
• 4:大连理工大学三束材料改性国家重点实验室大连理工大学材料科学与工程学院 辽宁大连116024

摘要(Abstract)：

研究了Sn-3Ag/Cu钎焊接头在液相钎焊和固相时效后界面金属间化合物(IMC)的生长行为和晶体取向。实验结果表明,液相反应和固相反应生成的IMC形貌差别很大;液相钎焊时IMC生长与时间的0.4次方成正比,而在固相时效时IMC生长与时间的平方根成正比,其生长激活能为90kJ/mol;通过液固晶体取向对比,发现液态钎焊和固相时效中晶体取向没有明显变化。

关键词(KeyWords)： 金属间化合物;生长;形貌;晶体取向

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(50271013);; 辽宁省科研基金(042020)

作者(Author): 程从前,赵杰,杨朋,朱凤

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