铝锂合金瞬间液相扩散连接接头的性能Properties of transient liquid phase diffusion bonding joint of Al-Li alloy
刘罗林,黄本生,李天宁,何子涛,郑建能
摘要(Abstract):
采用纯Zn箔作中间层,对2195铝锂合金进行瞬间液相扩散焊(TLP),采用光学显微镜、扫描电镜、X射线衍射、显微硬度计和万能试验机等研究了焊接温度对接头的显微组织、元素扩散、物相以及力学性能的影响。结果表明:随着焊接温度的升高,接头焊缝处元素扩散更充分,组织更均匀,但焊接温度过高时,焊缝处会出现母材过烧和晶粒粗大的现象;接头焊缝处物相主要由Al、Al_(0.71)Zn_(0.29)和CuZn_2金属间化合物组成;随着焊接温度的升高,接头显微硬度总体呈下降趋势,剪切强度呈先上升后下降的趋势,当焊接温度为560℃时,接头剪切强度最大,为96.7 MPa。
关键词(KeyWords): 铝锂合金;瞬间液相扩散焊;纯Zn箔;显微组织;力学性能
基金项目(Foundation): 国家自然科学基金(51704255)
作者(Author): 刘罗林,黄本生,李天宁,何子涛,郑建能
DOI: 10.13289/j.issn.1009-6264.2022-0308
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