竺培显,周生刚,孙勇,黄文芳,杨秀琴,许健,张瑾

• 1:昆明理工大学材料与冶金工程学院
• 2:昆明理工大学稀贵及有色金属先进材料教育部重点实验室

摘要(Abstract)：

利用键参数函数理论分析了第三组元Bi或Sn作为Al-Pb非混溶体系实现冶金结合一体化的可行性,并采用液-固包覆成型的方法制得了Al-Bi-Pb及Al-Sn-Pb层状复合材料,通过SEM、EDS等检测手段分析研究试样的显微组织,并讨论了界面的扩散现象。结果表明:第三组元Bi或Sn的引入将Al、Pb的混合焓ΔHmin降低到零以下,在扩散动力学作用驱使下使各元素间在界面处发生了迁移和互扩散,形成了成分调控区,表现为一条状的均质固溶体带,实现了Al与Pb之间的冶金结合。

关键词(KeyWords)： 层状复合材料;键参数函数;Al-Pb非混溶体系

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金资助项目(50664005);; 国家高技术研究发展计划(863)项目(2009AA03Z512)

作者(Author): 竺培显,周生刚,孙勇,黄文芳,杨秀琴,许健,张瑾

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