电压对掺锡微弧氧化涂层微观结构和生物性能的影响Effect of voltage on microstructure and biological properties of tin-doped micro-arc oxide coatings
李婧,杨巍,邓婉蓉,高巍,王力群
摘要(Abstract):
为研究电压对微弧氧化涂层微观结构和生物性能的影响,采用不同电压在锡酸盐电解液中对TC4钛合金进行微弧氧化处理。采用扫描电镜(SEM)和X射线衍射仪(XRD)分析涂层的微观组织结构及相组成,在模拟体液环境中借助摩擦磨损试验机和电化学工作站分别评价涂层的耐磨损性能及耐腐蚀性能,通过酶标仪测量菌液的光密度值(OD)评估涂层的抗菌性。结果表明:TC4钛合金微弧氧化涂层的物相主要由Ti相、金红石型TiO_2、锐钛矿型TiO_2、SiO_2和少量SnO_2组成;随电压升高,微弧氧化涂层厚度增加,涂层中的Sn元素含量增加;经微弧氧化处理能够改善TC4钛合金的耐磨性,微弧氧化涂层的磨损机制均为黏着磨损,随电压升高,涂层的摩擦系数及磨痕宽度均先减小后增大,在电压为450 V时,涂层表现出最佳的耐磨性;由于微弧氧化涂层存在缺陷及Sn、Ti间存在电位差,因此未能改善TC4钛合金的耐蚀性;当电压为500 V时,涂层的抗菌性最佳,菌液的光密度值为0.126。
关键词(KeyWords): TC4钛合金;电压;微弧氧化;耐磨性;抗菌性
基金项目(Foundation): 国家重点研发计划项目(2022YFE0122900);; 陕西省重点产业链项目(2021ZDLSF03-11)
作者(Author): 李婧,杨巍,邓婉蓉,高巍,王力群
DOI: 10.13289/j.issn.1009-6264.2024-0317
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