退火Cu-0.1Ag合金组织性能及再结晶特征Microstructure,properties and recrystallization characteristics of annealed Cu-0.1Ag alloy
李继林,常丽丽,李胜利,尚兴军
摘要(Abstract):
采用光学显微镜、硬度和电导率测试等方法研究了不同变形量Cu-0.1Ag铜银合金不同温度退火下的组织性能变化规律及再结晶特征。结果表明:随变形量增加,再结晶后晶粒更加细小;硬度在回复阶段几乎不变或略有上升,在再结晶阶段直线下降,再结晶完成后硬度趋于定值。退火温度越高,硬度下降较快,再结晶速率较快。电导率在回复与再结晶过程中显著上升,再结晶完成后电导率趋于定值。室温拉拔变形量26%及50%Cu-0.1Ag合金的再结晶激活能分别为82 k J/mol及69.6 k J/mol,在400~500℃范围内完成再结晶所需时间与温度函数关系分别为lnt=8.2×104/RT-7.56和lnt=6.96×104/RT-6.04。
关键词(KeyWords): Cu-0.1Ag合金;变形;退火;再结晶;激活能
基金项目(Foundation): 山东省自主创新专项资金(2013CXB60201);; 山东省自主创新及成果转化专项(2014CGZH0102)
作者(Author): 李继林,常丽丽,李胜利,尚兴军
DOI: 10.13289/j.issn.1009-6264.2016.09.014
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