形变Cu-20vol%Fe原位复合材料研究Investigation of a Deformation Processed Cu-20% Fe in Situ Composite
葛继平,陈美玲,刘书华
摘要(Abstract):
研究了形变Cu 2 0vol%Fe原位复合材料的组织结构 ,结果发现 ,合金经室温变形后 ,Fe相由铸造态的树枝状变成纤维状组织 ,在纵截面上呈现片状 ,其厚度随变形量增加而减小 ,在横断面上呈弯曲的薄片状。随变形量增加 ,Cu 2 0vol%Fe合金的强度提高。适当的中间热处理可以大大降低其电阻率 ,经过室温形变和中间热处理的合理配合 ,可获得良好强度和电导率的结合。
关键词(KeyWords): Cu-20vol%Fe;形变;复合材料;强度;电导率
基金项目(Foundation): 大连市科技计划资助 (2 0 0 2A1GX0 2 4 )
作者(Author): 葛继平,陈美玲,刘书华
参考文献(References):
- 1 SnoeckE ,LecouturierF ,ThillyL ,etal.MicrostructuralstudiesofinsituproducedfilamentaryCuNbwires[J].ScriptaMaterialia,1998,38(11):1643~1648.
- 2 SakaiY ,InoueK ,AsanoT ,etal.Developmentofhigh strength,high conductivityCuAgalloysforhigh fieldpulsedmagnetuse[J].AppliedPhysicsLetters,1991,59:2965~2967.
- 3 BevkJ,HarbisonJP ,BellJL .AnomalousincreaseinstrengthofinsituformedCuNbmultifilamentarycomposites[J].JApplPhys,1978,49:6031~6038.
- 4 BiselliC ,MorrisDG .MicrostructureandstrengthofCuFeinsitucompositesafterveryhighdrawingstrains[J].ActaMaterialia,1996,44:493~504.
- 5 JermanGA ,AndersonIE ,VerhoevenJD .Strengthandelectricalconductivityofdeformation processedCu15volpctFealloysproducedbypowdermetallurgytechniques[J].MetallTrans,1993,24A :35~42.
- 6 HongSI,SongJS ,KimHS .Thermo mechanicalprocesingandpropertiesofCu9Fe1.2Comicrocompositewires[J].ScriptaMater,2001,45(11):1295~1300.
- 7 HongSI,SongJS .StrengthandconductivityofCu9Fe1.2X(X =AgorCr)filamentarymicrocompositewires[J].MetallurgicalandMaterialsTransactionsA ,2001,32A(4):985~991.
- 8 BoltaxA .Precipitationprocessesincopper richcopper alloys[J].TransMetSocAIME ,1960,218:812~821.
- 9 SpitzigWA ,ChumbleyLS ,VerhoevenJD ,etal.EffectoftemperatureonthestrengthandconductivityofadeformationprocessedCu20%Fecomposite[J].JMaterSci,1992,27:2005~2011.
- 10 GoYS ,SpitzigWA .Strengtheningindeformation processedCu20%Fecomposites[J].JMaterSci,1991,26:163~171.
- 11 BiselliC ,MorrisDG .MicrostructureandstrengthofCuFeinsitucompositesobtainedfromprealloyedCuFepowders[J].ActaMater,1994,42:163~176.
- 12 HosfordWilliamF .Themechanicsofcrystalsandtexturedpolycrystals[M].Nowyork,1993:115~118.
- 13 VerhoevenJD ,DowningHI,ChumbleyLS ,etal.TheresistivityandmicrostructureofheavilydrawnCuNballoys[J].JApplPhys,1989,65:1293~1301.
- 14 HongSI,HillMA .MicrostructureandconductivityofCuNbmicrocompositesfabricatedbythebundlinganddrawingprocess[J].ScriptaMaterialia,2001,44:2509~2515.
- 15 FrankHeringhaus,HansJ rgSchneiderMuntau,G櫣nterGottstein.Analyticalmodelingoftheelectricalconductivityofmetalmatrixcomposites:applicationtoAgCuandCuNb[J].MaterialsScienceandEngineering,2002,347:9~20.
- 16 PeltonAR ,LaabsFC ,SpitzigWA ,etal.Microstructuralanalysisofin situCuNbcompositewires[J].Ultramicroscopy,1987,22:251~265.
- 17 HongSIHillMA .MicrostructuralstabilityandmechanicalresponseofCuAgmicrocompositewires[J].ActaMetallMater,1998,46:4111~4122.
- 18 HongSI,HillMA .MicrostructuralstabilityofCuNbmicrocompositewiresfabricatedbythebundlinganddrawingprocess[J].MaterSciEng,2000,281:189~197.
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