刘勇,李辉,杨志强,田保红,张毅

• 1:河南科技大学材料科学与工程学院
• 2:有色金属共性技术河南省协同创新中心
• 3:开封大学机械与汽车工程学院

摘要(Abstract)：

采用真空热压-内氧化烧结法成功制备Ti C粒径分别为3.2和25μm的30 vol%Ti C/Cu-Al2O3复合材料,对其进行了显微组织观察分析和性能测试;并利用Gleeble-1500D热力模拟试验机,研究了该复合材料在变形温度为450~850℃,应变速率为0.001~1 s-1条件下的热变形行为。结果表明:随着Ti C粒径的增大,复合材料的相对密度和导电率有所增加,而硬度略有下降。Ti C/Cu-Al2O3复合材料的真应力-真应变曲线主要以动态再结晶机制为特征,峰值应力随变形温度的降低或应变速率的升高而增加;高温变形条件下30 vol%Ti C/Cu-Al2O3复合材料流变应力本构方程可以用双曲线正弦方程和Z参数描述;热变形激活能随Ti C粒径增大而略有下降,其值分别为269.059 k J/mol(3.2μm)和234.288 k J/mol(25μm)。

关键词(KeyWords)： 颗粒增强铜基复合材料;TiC;粒径;激活能;本构方程

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51101052);; 河南省高校重点科研项目(15A430006)

作者(Author): 刘勇,李辉,杨志强,田保红,张毅

DOI: 10.13289/j.issn.1009-6264.2015.08.001

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