董丽,董桂霞,刘秋香,张茜,李尚劼

• 1:华北理工大学材料科学与工程学院河北省无机非金属材料重点实验室
• 2:深圳市海明润实业有限公司

摘要(Abstract)：

采用超高压熔渗法制备金刚石/铜复合材料,研究了烧结温度、烧结压力及保温时间等因素对复合材料成分、界面状态和热导率的影响,利用XRD、SEM对金刚石/铜复合材料的相组成和微观形貌进行分析。结果表明:复合材料的相对密度随着烧结温度、烧结压力及金刚石颗粒粒径的增大而增加,且熔渗合金的复合材料的热导率高于熔渗铜的复合材料的热导率。当金刚石粒径为200μm,熔渗烧结温度在1300℃,压力为5 GPa,保温5 min时,得到最高的热导率,为870 W/(m·K)。

关键词(KeyWords)： 超高压烧结;金刚石/铜复合材料;热导率

Abstract:

Keywords:

基金项目(Foundation): 中俄国际合作项目(2012DFR50350)

作者(Author): 董丽,董桂霞,刘秋香,张茜,李尚劼

DOI: 10.13289/j.issn.1009-6264.2015.s2.003

参考文献(References)：

• [1]马双彦,王恩泽,鲁伟员,等.金刚石/铜复合材料热导率研究[J].热加工工艺,2008,37(4):36-38.MA Shuang-yan,WANG En-ze,LU Wei-yuan,et al.Study on thermal conductivity of diamond/copper composite[J].Hot Working Technology,2008,37(4):36-38.
• [2]张习敏,郭宏,尹法章,等.金刚石/铜复合材料界面结合状态的改善方法[J].稀有金属,2013,37(2):335-339.ZHANG Xi-min,GUO Hong,YIN Fa-zhang,et al.Improving method of interface bonding state in diamond/Cu composite material[J].Rare Metals,2013,37(2):335-339.
• [3]Gray K J.Effective thermal conductivity of a diamond coated heat spreader[J].Diamond and Related Materials,2000,9(2):201-204.
• [4]Zhao J,Tian R,Zhi J.Electroless deposition of copper and fabrication of copper micropatterns on CVD diamond film surfaces[J].Applied Surface Science,2008,254(11):3282-3287.
• [5]童震松,沈卓身.金属封装材料的现状及发展[J].电子与封装,2005,5(3):6-15.TONG Zhen-song,SHEN Zhuo-shen.Status and development of materials for metal packaging[J].Electronics and Packaging,2005,5(3):6-15.
• [6]Puttick K E.Properties of natural and synthetic diamond:Ed J E Field[J].Tribology International,1994,27(3):208-209.
• [7]赵妍冰,刘克明,陆德平,等.金刚石/铜电子封装复合材料的研究状况及展望[J].热处理技术与装备,2013,34(6):31-36.ZHAO Yan-bing,LIU Ke-ming,LU De-ping,et al.Research on status and prospect of CD/Cu composite for electronic packaging materials[J].Heat Treatment Technology and Equipment,2013,34(6):31-36.
• [8]Zweben C.Advances in composite materials for thermal management in electronic packaging[J].Journal of Metals,1998,50(6):47-52.
• [9]Yoshida K,Morigami H.Thermal properties of diamond/copper composite materials[J].Microelectron Reliability,2004,44(2):303-308.
• [10]Schubert T,Ciupinski L,Zielinski W,et al.Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications[J].Scr Mater,2008,58(4):263-266.
• [11]Chu K,Liu Z F,Jia Ch Ch,et al.Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles[J].J Alloys Compd,2010,490(1/2):453-458.
• [12]夏扬,谢元峰,宋月清,等.高温高压烧结金刚石-铜复合材料的研究[J].金刚石与磨料磨具工程,2010,30(6):44-49.XIA Yang,XIE Yuan-feng,SONG Yue-qing,et al.Investigation on diamond-Cu composites prepared by HTHP sintering process[J].Diamond and Abrasives Engineering,2010,30(6):44-49.

文章评论(Comment)：