章楚璨,张男,高维林,张承志,杨文迪,赵转

• 1:郑州大学材料科学与工程学院
• 2:郑州大学稀有金属特种材料全国重点实验室

摘要(Abstract)：

采用真空熔炼法制备了Cu-0.6Ni-xP(x=0.106、0.130、0.158、0.195和0.253 mass%)合金，并对其进行固溶-时效-冷轧处理。结果表明：随着P含量的增加，合金的硬度增大，电导率降低，其中Cu-0.6Ni-0.158P合金的综合性能最佳；经750℃固溶处理5 min+400℃时效24 h后，Cu-0.6Ni-0.158P合金峰时效态显微硬度为138.73 HV0.5,电导率为67.50%IACS,析出相为h-Ni_2P,尺寸为5～15 nm,且与Cu基体之间存在位相关系：■;峰时效态的Cu-0.6Ni-0.158P合金经80%冷轧处理，其显微硬度为200.20 HV0.5,抗拉强度为635.00 MPa,电导率为56.20%IACS;Cu-0.6Ni-xP合金的强化机制主要为位错强化、晶界强化和析出强化，在Cu-0.6Ni-0.158P合金中晶界强化贡献值最高，达到40.18%,析出强化和位错强化贡献值分别为20.10%和29.73%。

关键词(KeyWords)： Cu-Ni-P合金;时效处理;析出相;抗拉强度;电导率

Abstract:

Keywords:

基金项目(Foundation): 国家重点研发计划(2022YFC2904900);; 工程院战略咨询项目(2024-DFZD-37)

作者(Author): 章楚璨,张男,高维林,张承志,杨文迪,赵转

DOI: 10.13289/j.issn.1009-6264.2024-0230

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