郭明海,刘俊友,贾成厂,果世驹,李艳霞

• 1:北京科技大学材料科学与工程学院
• 2:北华航天工业学院材料系

摘要(Abstract)：

采用半固态触变液固分离工艺制备出底部具有高体积分数SiC(63 vol%)的Al基功能梯度电子封装壳体,借助光学显微镜和扫描电镜分析了壳体复合材料中SiC的形态分布及其断口形貌,并测定了其热物理性能和力学性能。结果表明,原始30vol%SiCp/Al复合材料在半固态触变成形中SiC颗粒和液相产生分离流动,液相从壳体中流出,SiC颗粒在壳体中聚集,其体积分数从壳体底面向四壁逐渐降低。组织和性能呈梯度变化。壳体底面具有高的热导率和低的热膨胀系数(CTE),这与芯片材料相匹配,壳体四壁具有良好的焊接性能。

关键词(KeyWords)： 液固分离;SiCp/Al复合材料;功能梯度材料;电子封装壳体

Abstract:

Keywords:

基金项目(Foundation):

作者(Author): 郭明海,刘俊友,贾成厂,果世驹,李艳霞

DOI: 10.13289/j.issn.1009-6264.2014.04.006

参考文献(References)：

• [1]刘玫潭,蔡旭升,李国强.高性能SiC增强Al基复合材料的显微组织和热性能[J].中国有色金属学报,2013,23(4):1040-1046.LIU Mei-tan,CAI Xu-sheng,LI Guo-qiang.Microstructure and thermal properties of high-performance SiC reinforced Al matrix composite[J].The Chinese Journal of Nonferrous Metals,2013,23(4):1040-1046.
• [2]刘正春,王志法,姜国圣.金属基电子封装材料进展[J].兵器材料科学与工程,2010,24(2):49-54.LIU Zheng-chun,WANG Zhi-fa,JIANG Guo-sheng.Advances in metal-matrix material for electronic packaging[J].Ordnance Material Science and Engineering,2010,24(2):49-54.
• [3]Jin S H.Advances in thermal management materials for electronic applications[J].The Journal of the Minerals Metals and Materials Society,1998,50(6):46-52.
• [4]张东明,张联盟,顾晓峰,等.一种具有激光可焊性的高导热电子封装壳体的制备方法:中国,CN200610125306.5[P].2007-05-30.ZHANG Dong-ming,ZHANG Lian-meng,GU Xiao-feng,et al.A preparation method of high conductivity electronic packaging shell with laser weld ability:China,CN200610125306.5[P].2007-05-30.
• [5]Carl Z.Advanced in composite materials for thermal management in electronic packaging[J].The Journal of the Minerals Metals and Materials Society,1998,50(6):47-51.
• [6]Rawal S.Metal-matrix composites for space application[J].Journal of Metals,2001,53(4):14-17.
• [7]赵志远.铝和铝合金牌号与金相图谱速用速查及金相检验技术创新应用指导手册[M].北京:中国知识出版社,2005:71-72.
• [8]强华,徐尊平.颗粒几何特征对SiC颗粒增强Al基复合材料力学行为的影响[J].轻合金加工技术,2008,36(10):46-49.QIANG Hua,XU Zun-ping.Effect of particle geometrical characteristic on mechanical behavior of SiC particle reinforced aluminum matrix composites[J].Light Alloy Fabrication Technology,2008,36(10):46-49.
• [9]Bertand P,Vidal-setif M H,Mevrel R.The CVD of pyrolytic carbon and titanium diboride coatings on carbon fibre yarns for use in aluminium-based composites[J].Surface and Coatings Technology,1997,96(2):283-292.
• [10]Revzin B,Fuks D,Pelleg J.Influence of alloying on the solubility of carbon fibers in aluminium-based composites:Non-empirical approach[J].Composites Science and Technology,1996,56(1):3-10.
• [11]路贵民,只立群.半固态金属触变成形本构关系的研究现状[J].汽车工程,2009,31(5):430-434.LU Gui-min,ZHI Li-qun.The current status of research on the constitutive relations of semi-solid metal thixoforming[J].Automotive Engineering,2009,31(5):430-434.
• [12]Wang K K,Kang Y L,Song P G.Preparation of SiCp/A356 electronic packaging materials and its thixo-forging[J].Transactions of Nonferrous Metals Society of China,2010,20(S3):s988-s992.
• [13]杨沛,于治水,祁凯,等.Al2O3/Kovar钎焊接头裂纹冶金因素分析[J].华东船舶工业学院学报,2005,19(1):86-89.YANG Pei,YU Zhi-shui,QI Kai,et al.Mechanisms of cracks forming in Al203/Kovar brazing joint[J].Journal of East China Shipbuilding Institute,2005,19(1):86-89.
• [14]董月玲,黄继华,闫久春,等.碳化硅增强铝基复合材料连接技术研究进展[J].材料导报,2003,17(11):63-65.DONG Yue-ling,HUANG Ji-hua,YAN Jiu-chun,et al.Progress in reseach on joining SiC reinforced aluminum metal matrix composites[J].Materials Review,2003,17(11):63-65.
• [15]杨会娟,王志法,姜国圣,等.轧制复合制备Kovar/Cu/Kovar层状复合材料[J].稀有金属与硬质合金,2004,32(2):7-10.YANG Hui-juan,WANG Zhi-fa,JIANG Guo-sheng,etc.Preparation of Kovar/Cu/Kovar laminates by rolling combination[J].Rare Metals and Cemented Carbides,2004,32(2):7-10.
• [16]Geiger A L,Jackson M.Low-expansion MMCs boost avionics[J].Advanced Materials&Processes,1989,136(7):23-28.
• [17]李艳霞,刘俊友,刘国权,等.液固分离法制备Al-65vol%Si电子封装材料组织及性能[J].材料热处理学报,2012,33(3):40-45.LI Yan-xia,LIU Jun-you,LIU Guo-quan,et al.Microstructure and properties of Al-65vol%Si alloy fabricated by a process of liquid and solid separation[J].Transactions of Materials and Heat Treatment,2012,33(3):40-45.
• [18]中国电子学会生产技术学分会丛书编委会.微电子封装技术[M].合肥:中国科学技术大学出版社,2003:2-7.

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