Ni5W合金基带的热处理工艺Heat treatment process for Ni5W alloy substrate
王雪,李成山,于泽铭,郑会玲,樊占国
摘要(Abstract):
为了制备能够满足YBCO涂层导体所需的高强、低磁性基带,采用轧制辅助双轴织构技术(RABiTS)制备Ni-5at%W(Ni5W)合金基带,在不同温度及热处理制度下进行再结晶热处理。采用背散射电子衍射技术对基带织构情况进行研究,结果表明,Ni5W合金基带的初始再结晶温度为700℃,随退火温度升高,轧制织构不断向立方织构转变,在1200℃时立方织构百分含量接近100%。采用700℃预退火30 min后在进行1200℃退火1 h后,基带立方织构含量仍然很高,并且比一步退火法获得的立方织构更为锐利。
关键词(KeyWords): Ni5W合金基带;热处理;再结晶;织构
基金项目(Foundation): 国家“863”计划(2009AA032401);; 陕西省自然基金(2009JM6002);; 中央高校基本科研业务费专项基金(N090602008)
作者(Author): 王雪,李成山,于泽铭,郑会玲,樊占国
DOI: 10.13289/j.issn.1009-6264.2014.10.011
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