高强高导铜合金的强化机理与研究热点Strengthening mechanism and research focus of high strength and high conductivity copper alloy
代雪琴,贾淑果,范俊玲,宋克兴,周延军,马映璇,肖振朋,牛立业,郭慧稳
摘要(Abstract):
铜合金材料作为高新技术产业的主流材料,需同时具备高强高导的性能。但是根据不同的应用环境,在保持高导电率的前提下如何选择合适的强化方法是制备铜合金的瓶颈。据研究可知,合金化法(形变强化、时效强化、固溶强化、细晶强化)和复合材料法(人工复合材料法、自身复合材料法)可以提高铜合金材料强度,但对其导电率有一定的影响。通过添加稀土元素、快速凝固法或大塑性变形等强化方法,有望获得高强度、高导电率的铜合金。本文着重探讨了合金化法和复合材料法的强化机理及其优缺点,并对铜合金的研究热点进行讨论和展望。
关键词(KeyWords): 合金化法;复合材料法;稀土元素;快速凝固法;大塑性变形
基金项目(Foundation): 河南省创新引领专项(191110210400);; 河南省自然科学基金(202300410139);; 中国工程科技发展战略河南研究院战略咨询研究项目(2021HENZDA02);; 河南省重点研发与推广专项(212102210441);; 河南省高等学校重点科研项目(19A430012)
作者(Author): 代雪琴,贾淑果,范俊玲,宋克兴,周延军,马映璇,肖振朋,牛立业,郭慧稳
DOI: 10.13289/j.issn.1009-6264.2021-0191
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