刘四洲,程朝阳,钟柏林,王小小,刘静

• 1:武汉科技大学省部共建耐火材料与冶金国家重点实验室
• 2:深圳大学材料学院

摘要(Abstract)：

采用光学显微镜、电子背散射衍射、万能拉伸试验机和磁性能测量仪等研究了线切割和激光切割两种加工方式对含Cu高强度无取向硅钢组织及力学、磁性能的影响。结果表明：激光切割会使试样加工边缘晶粒粗化，而线切割则会细化加工边缘晶粒，并且影响区域均约为0.21 mm。此外，在线切割加工试样边缘还观察到应力集中现象。由于加工方式对试样晶粒尺寸及应力状态的影响，导致线切割加工试样加工边缘区域硬度值高于激光切割试样，并且抗拉强度与屈服强度均高于激光切割试样。同时，线切割加工试样磁感略低于激光切割试样，铁损显著高于激光切割试样。

关键词(KeyWords)： 含Cu高强度无取向硅钢;加工方式;微观组织;力学性能;磁性能

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(52274393和52074200);; 湖北省重大科技专项(2023BAB141);; 湖北省自然科学基金(2022CFB091)

作者(Author): 刘四洲,程朝阳,钟柏林,王小小,刘静

DOI: 10.13289/j.issn.1009-6264.2023-0539

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