武磊,刘雅政,程晓杰,孙有博,田荣斌,闫波,张晓燕

• 1:北京科技大学材料科学与工程学院
• 2:包头钢铁集团公司薄板厂

摘要(Abstract)：

研究了回复与再结晶对CSP流程冷轧深冲板"饼型"晶粒尺寸分布规律的影响。采用在退火升温过程中的不同温度增加保温台阶的方法,使冷轧钢板实现不同程度的回复和再结晶。随增加的保温台阶温度提高,退火板的晶粒沿轧向的分布逐渐趋于Weibull分布,沿板厚方向的分布对Weibull函数的拟合R2在台阶温度为540℃时最低,580℃最高。分析后认为,具有"饼型"晶粒特征的CSP流程冷轧深冲钢板,晶粒尺寸分布规律受钢板中织构和析出相粒子的共同影响。

关键词(KeyWords)： CSP流程;冷轧深冲板;晶粒尺寸分布;织构

Abstract:

Keywords:

基金项目(Foundation):

作者(Author): 武磊,刘雅政,程晓杰,孙有博,田荣斌,闫波,张晓燕

DOI: 10.13289/j.issn.1009-6264.2010.08.014

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