张毅,刘平,田保红,陈小红,贾淑果,刘勇,任凤章

• 1:河南科技大学材料科学与工程学院
• 2:河南省有色金属材料科学与加工技术重点实验室
• 3:上海理工大学机械工程学院

摘要(Abstract)：

利用Gleeble-1500D热模拟试验机,采用高温等温压缩试验,对Cu-2.0Ni-0.5Si-0.03P合金在应变速率为0.01～5 s-1、变形温度为600～800℃、最大变形程度为60%条件下的动态再结晶行为以及组织转变进行了研究。利用加工硬化率和应变(θ-ε)的关系曲线确定了该合金发生动态再结晶的形变条件为T≥700℃。根据σ-ε曲线确定了不同变形条件下该合金的动态再结晶的体积分数,利用该体积分数建立了该合金的动态再结晶动力学数学模型。该合金动态再结晶的显微组织受变形速率的影响,在变形速率较低时,晶体内有较多的再结晶晶粒;而在较高应变速率下,合金几乎没有发生动态再结晶。

关键词(KeyWords)： Cu-2.0Ni-0.5Si-0.03P合金;加工硬化率应变曲线;动态再结晶体积分数;动态再结晶动力学模型

Abstract:

Keywords:

基金项目(Foundation): 国家高新技术研究发展计划(863计划)资助项目(2006AA03Z528);; 国家自然科学基金(50571035);; 河南省杰出青年基金(0521001200);; 河南科技大学博士启动基金(09001414)

作者(Author): 张毅,刘平,田保红,陈小红,贾淑果,刘勇,任凤章

DOI: 10.13289/j.issn.1009-6264.2010.07.019

参考文献(References)：

• [1]Liu P,Kang B X,Cao X G.Aging precipitation and recrystallization of rapidly solidified Cu-Cr-Zr-Mg alloy[J].The Chinese Journal of NonferrousMetals,1999,9(2):241-246.
• [2]Blaz L,Korbel A,Kusinski J.Retardation of fracture by static precipitation in a hot deformed Cu-Ni-Cr-Si-Mg alloy[J].Script Metallurgic etMaterial,1995,33(4):657-660.
• [3]Suzuki S,Shibutani N,Mimura K,et al.Improvement in strength and electrical conductivity of CuNiSi alloy by aging and cold rolling[J].Journal ofAlloys and Compounds,2006,417:116-120.
• [4]雷静果,刘平,赵冬梅,等.用导电率研究Cu-Ni-Si-Cr合金时效早期相变动力学[J].材料热处理学报,2003,24(4):22-25.LEI Jing-guo,LIU Ping,ZHAO Dong-me,et al.Study on the transformation kinetics of early stage aging of Cu-Ni-Si Alloy by measuring the electricconductivity[J].Transactions of Materials and Heat Treament,2003,24(4):22-26.
• [5]Su Juan-hua,Dong Qi-ming,Liu Ping,et al.Research on aging precipitation in a Cu-Cr-Zr-Mg alloy[J].Materials Science and Engineering A,2005,392(1-2):422-426.
• [6]Zhao D M,Dong Q M,Liu P,et al.Structure and strength of the age hardened Cu-Ni-Si alloy[J].Materials Chemistry and Physics,2003,79:81-86.
• [7]Witusiewicz V T,Arpshofen I,Seifert H J,et al.Enthalpy of mixing of liquid and undercooled liquid ternary and quaternary Cu-Ni-Si-Zr alloys[J].Journal of Alloys and Compounds,2002,337:155-167.
• [8]Hong S I,Hill M A.Microstructure and conductivity of Cu-Nb microcomposites fabricated by the bundling and drawing process[J].ScriptaMaterialia,2001,44(10):2509-2515.
• [9]张鸿冰,张斌,柳建韬.钢中动态再结晶力学测定及其数学模型[J].上海交通大学学报,2003,37(7):1053-1056.ZHANG Hong-bing,ZHANG Bin,LIU Jian-tao.Dynamics measurement and mathematical models of dynamic recrystallization of steel[J].Journal ofShangHai Jiaotong University,2003,37(7):1053-1056.
• [10]Gao W,Belyakov A.Dynamic recrystallization of copper polyerystals with diferent purities[J].Materals Science and Engineering A,1999,265:233-238.
• [11]Tan J C,Tan M J.Dynamic continuous recrystallization characteristics in two stage deformation of Mg-3Al-1Zn alloy sheet[J].Materials Scienceand Engineering A,2003,339:124-132.

文章评论(Comment)：