罗金宝,巢国辉,项燕龙,华称文,傅杰,裘桂群,李周

• 1:宁波金田铜业(集团)股份有限公司
• 2:中南大学材料科学与工程学院

摘要(Abstract)：

利用光学显微镜、X射线衍射(XRD)、电子背散射衍射(EBSD)技术、万能试验机等分析了轧制和热处理工艺对Cu-Sn-P合金带材晶粒尺寸、晶粒取向、组织分布和性能的影响，并建立了形变热处理工艺-带材微观组织-带材折弯性能之间的联系。结果表明：Cu-Sn-P合金带材先经过70%变形量的冷轧加工，再在650℃下进行走带速度为65 m·min~(-1)连续退火处理后，可将带材的变形加工组织与再结晶组织比例控制在5:1左右，带材的晶粒平均直径为3.5μm,且晶粒大小均匀。随后经15%冷轧变形和230℃保温3 h的低温去应力退火处理后，合金带材抗拉强度达到716 MPa,在垂直于带材轧制方向和平行于轧制方向分别进行180°折弯测试，带材表面在相对弯曲半径R/t≤1.5时均不开裂且无明显大褶皱。

关键词(KeyWords)： Cu-Sn-P合金;形变热处理;连续退火;晶粒取向;折弯性能

Abstract:

Keywords:

基金项目(Foundation): 宁波市重大科技任务攻关项目(2021Z032)

作者(Author): 罗金宝,巢国辉,项燕龙,华称文,傅杰,裘桂群,李周

DOI: 10.13289/j.issn.1009-6264.2022-0379

参考文献(References)：

• [1] Geng Y F,Li X,Zhou H L,et al.Effect of Ti addition on microstructure evolution and precipitation in Cu-Co-Si alloy during hot deformation[J].Journal of Alloys and Compounds,2020,821:153518.
• [2] Zheng Z S,Guo P S,Li J G,et al.Effect of cold rolling on microstructure and mechanical properties of a Cu-Zn-Sn-Ni-Co-Si alloy for interconnecting devices[J].Journal of Alloys and Compounds,2020,831:154842.
• [3] 张盼盼，张城瑞.热变形温度对Cu-Sn-P合金微观组织的影响[J].金属热处理，2019,44(3):167-170.ZHANG Pan-pan,ZHANG Cheng-rui.Effect of thermal deformation temperature on microstructure of Cu-Sn-P alloy[J].Heat Treatment of Metals,2019,44(3):167-170.
• [4] Du Y B,Zhou Y J,Song K X,et al.Zr-containing precipitate evolution and its effect on the mechanical properties of Cu-Cr-Zr alloys[J].Journal of Materials Research and Technology,2021,14:1451-1458.
• [5] 陆萌萌，胡艳艳，郑少峰，等.C5210铜合金带材组织与性能的研究[J].上海有色金属，2014,35(4):145-149.LU Meng-meng,HU Yan-yan,ZHENG Shao-feng,et al.Research on microstructure and properties of C5210 copper alloy strip[J].Shanghai Nonferrous Metals,2014,35(4):145-149.
• [6] Hu D C,Chen M H,Wang L,et al.Microstructural characterization of blanked surface of C5191 phosphor bronze sheet under ultra-high-speed blanking[J].Transactions of Nonferrous Metals Society of China,2021,31(3):692-702.
• [7] Karthik M,Abhinav J,Shankar K V.Morphological and mechanical behaviour of Cu-Sn alloys-A review[J].Metals and Materials International,2021,27(7):1915-1946.
• [8] Hui J,Feng Z,Fan W,et al.Microstructures and mechanical properties of Cu-Sn alloy subjected to elevated-temperature heat deformation[J].Materials Research Express,2018,5(4):046511.
• [9] 徐灏，朱协彬，宣夕文，等.低温退火对锡磷青铜 C5191组织和机械性能的影响[J].安徽工程大学学报，2015(1):48-51.XU Han,ZHU Xie-bin,XUAN Xi-wen,et al.Effects of low temperature annealing on the microstructure and mechanical properties of tin phosphor bronze C5191[J].Journal of Anhui Polytechnic University,2015(1):48-51.
• [10] Li J Z,Ding H,Gao W L,et al.Microstructure and bending properties of Cu-Cr-Zr alloy subjected to heat treatment and rolling[J].Journal of Materials Engineering and Performance,2021,30(8):5825-5833.
• [11] Qi M F,Kang Y L,Li J Y,et al.Synchronously improving the thermal conductivity and mechanical properties of Al-Si-Fe-Mg-Cu-Zn alloy die castings through ultrasonic-assisted rheoforming[J].Acta Metallurgica Sinica (English Letters),2021,34(10):1331-1344.
• [12] Li Y D,Yang B B,Zhang P,et al.Cu-Cr-Mg alloy with both high strength and high electrical conductivity manufactured by powder metallurgy process[J].Materials Today Communications,2021,27:102266.
• [13] Liu F,Ma J M,Peng L J,et al.Hot Deformation behavior and microstructure evolution of Cu-Ni-Co-Si alloys[J].Materials,2020,13(9):2042.
• [14] Avery D Z,Phillips B J,Mason C J T,et al.Influence of grain refinement and microstructure on fatigue behavior for solid-state additively manufactured Al-Zn-Mg-Cu alloy[J].Metallurgical and Materials Transactions A,2020,51(6):2778-2795.
• [15] Masuda T,Sauvage X,Hirosawa S,et al.Achieving highly strengthened Al-Cu-Mg alloy by grain refinement and grain boundary segregation[J].Materials Science and Engineering A,2020,793:139668.
• [16] Wang L,Bhatta L,Xiong H,et al.Mechanical properties and microstructure evolution of an Al-Cu-Li alloy subjected to rolling and aging[J].Journal of Central South University,2021,28(12):3800-3817.
• [17] Zang Q H,Chen H M,Lee Y S,et al.Improvement of anisotropic tensile properties of Al-7.9Zn-2.7Mg-2.0Cu alloy sheets by particle stimulated nucleation[J].Journal of Alloys and Compounds,2020,828:154330.
• [18] Aoyama S,Urao R.Effects of grain size and Sn concentration on bending fatigue life of Cu-Sn alloy[J].Journal of the Japan Institute of Metals,2010,74(1):49-54.
• [19] 涂德华，张鑫.连接器用铜及铜合金带弯曲性能对比研究[J].机电元件，2016,36(4):15-18.TU De-hua,ZHANG Xin.Comparative study for bending property of copper and copper alloy strip for connector[J].Electromechanical Components,2016,36(4):15-18.
• [20] Liu C L,Garner A,Zhao H,et al.CALPHAD-informed phase-field modeling of grain boundary microchemistry and precipitation in Al-Zn-Mg-Cu alloys[J].Acta Materialia,2021,214:116966.
• [21] Zhao Y X,Liu X Y,Zhu J,et al.Unusually high flexibility of graphene-Cu nanolayered composites under bending[J].Physical Chemistry Chemical Physics,2019,21(31):17393-17399.
• [22] Wang G J,Liu H T,Song K X,et al.Aging process and strengthening mechanism of Cu-Cr-Ni alloy with superior stress relaxation resistance[J].Journal of Materials Research and Technology,2022,19:3579-3591.
• [23] Yuan Y,Li Z,Xiao Z,et al.Microstructure evolution and properties of Cu-Cr alloy during continuous extrusion process[J].Journal of Alloys and Compounds,2017,703:454-460.
• [24] Liu G Y,Ji S X.Microstructure,dynamic restoration and recrystallization texture of Sn-Cu after rolling at room temperature[J].Materials Characterization,2019,150:174-183.
• [25] Yang J Z,Bu K,Song K X,et al.Influence of low-temperature annealing temperature on the evolution of the microstructure and mechanical properties of Cu-Cr-Ti-Si alloy strips[J].Materials Science and Engineering A,2020,798:140120.
• [26] Mehreen S U,Nogita K,McDonald S D,et al.Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime[J].Acta Materialia,2021,220:117295.

文章评论(Comment)：