丁志敏,冯秋元,宋建敏,高宏

• 1:大连交通大学材料科学与工程学院
• 2:宝钛集团有限公司
• 3:辽宁省无机超细粉体制备及应用重点实验室

摘要(Abstract)：

结合扫描电镜形貌观察和能谱分析研究了AlCl3-NaCl-KCl低温无机熔盐体系中电镀铝时电流密度对Q235钢基体上铝晶粒沉积形貌的影响,并从铝晶粒沉积过程中总的自由能变化的角度对其析出规律进行探讨。结果表明,在由80%AlCl3+10%NaCl+10%KCl所组成的熔盐中,当温度为150℃、电流密度为20.0～98.7 mA/cm2范围内电镀时,均可在Q235钢表面上获得完整、致密的铝镀层。电流密度的大小直接影响铝晶粒的形态和尺寸。电流密度低时,铝晶粒呈片状;电流密度高时,铝晶粒呈颗粒状,且随电流密度的增大,铝晶粒尺寸呈现减小趋势。结合热力学和动力学探讨了电流密度大小对电镀铝晶粒尺寸及形貌的影响。电流密度对铝晶粒形貌的影响与铝晶粒在Q235钢基体上沉积时形核及长大过程中的总自由能变化,特别是由电流密度大小所决定的铝晶核析出电化学能的大小有关。

关键词(KeyWords)： 熔盐电镀;铝晶粒;电流密度;自由能;电化学能

Abstract:

Keywords:

基金项目(Foundation): 辽宁省高等学校重点实验室项目(2008S038)

作者(Author): 丁志敏,冯秋元,宋建敏,高宏

DOI: 10.13289/j.issn.1009-6264.2012.09.027

参考文献(References)：

• [1]杨宝刚,孙舒萍,高炳亮,等.熔盐电解铝和铝合金[J].有色矿冶,1998,14(4):43-46.YANG Bao-gang,SUN Shu-ping,GAO Bing-liang,et al.Electrolysis aluminum and aluminum alloys in molten salts[J].Non-ferrous Mining andMetallurgy,1998,14(4):43-46.
• [2]Jafarian M,Mahjani M G,Gobal F,et al.Electrodeposition of aluminum from molten AlCl3-NaCl-KCl mixture[J].Journal of AppliedElectrochemistry,2006,36(10):1169-1173.
• [3]杨占红,王小花,陈建华,等.无机熔盐中脉冲铝镀层的研究[J].轻金属,2007(6):62-64.YANG Zhan-hong,WANG Xiao-hua,CHEN Jian-hua,et al.The investigation of pulse plating Al coating in inorganic molten salt[J].Light Metals,2007(6):62-64.
• [4]冯秋元,丁志敏,贾利山,等.低温熔融盐电镀铝的研究[J].材料保护,2004,37(4):1-3.FENG Qiu-yuan,DING Zhi-min,JIA Li-shan,et al.Low temperature electroplating aluminum in molten salt[J].Materials Protection,2004,37(4):1-3.
• [5]WANG Yu-jiang,MA Xin-xin,GUO Guang-wei.Electrodeposition of aluminum on 316L stainless steel from molten salts based on chlorides[J].KeyEngineering Materials,2008,373-374:273-276.
• [6]Jafarian M,Mahjani M G,Gobal F,et al.Effect of potential on the early stage of nucleation and growth during aluminum electrocrystallization frommolten salt(AlCl3-NaCl-KCl)[J].Journal of Electroanalytical Chemistry,2006,588(2):190-196.
• [7]Grjotheim K,MatiaovskK.Some problems concerning aluminum electroplating in molten salts[J].Acta Chemica Scandinavica A,1980,34(9):666-670.
• [8]冯秋元,丁志敏.熔融盐电镀铝的研究进展[J].电镀与环保,2003,23(5):1-4.FENG Qiu-yuan,DING Zhi-min.Progress in the research on electroplating of aluminum in molten salts[J].Electroplating&Pollution Control,2003,23(5):1-4.
• [9]宋国泰,牛洪军,孙一唐,等.黄铜熔盐电解沉积铝工艺研究[J].吉林工业大学学报,1992,22(3):114-118.SONG Guo-tai,NIU Hong-jun,SUN Yi-tang,et al.Electrodepositing aluminum upon brass from chloride molten salt bath[J].Journal of JilinUniversity of Technology,1992,22(3):114-118.
• [10]Nayak B,Misra M M.The electrodeposition of aluminum on brass from a molten aluminum chloride-sodium chloride bath[J].Journal of AppliedElectrochemistry,1977,7(1):45-50.
• [11]Li Q F,Hjuler H A,Berg R W,et al.Electrochemical deposition of aluminum from NaCl-AlCl3melts[J].Journal of the Electrochemical Society,1990,137(2):593-597.
• [12]Grjotheim Kai,MatiaovskKamil.Some problems concerning aluminium electroplating in molten salts[J].Acta Chemica Scandinavica A,1980,34(9):666-670.
• [13]牛洪军,孙国恩,宋国泰.AlCl3-NaCl熔盐电镀铝及其耐蚀性[J].腐蚀与防护,1994,15(2):61-63.NIU Hong-jun,SUN Guo-en,SONG Guo-tai.Electroplating aluminum and its corrosion resistance in AlCl3-NaCl molten salts[J].Corrosion&Protection,1994,15(2):61-63.
• [14]Fellner P,Chrenková-PauírováM,MatiaovskK.Electrolytic aluminum plating in molten salt mixtures based on AlCl3I:influence of the addition oftetramethylammonium chloride[J].Surface Technology,1981,14(2):101-108.
• [15]Chrenková-PauírováM,Fellner P,Silny A,et al.Electrolytic aluminum plating in molten salt mixtures based on AlCl3II:influence of the applicationof the pulsed current and of a copper underlayer[J].Surface Technology,1982,16(1):15-21.
• [16]Nayak B,Misra M M.The electrodeposition of aluminum on mild steel from a molten aluminum chloride/sodium chloride bath[J].Journal of AppliedElectrochemistry,1979,9(6):699-706.
• [17]Paunovic M,Schlesinger M.Fundamentals of Electrochemical Deposition[M].2nd Edition,John Wiley&Sons,Inc.,Hoboken,New Jersey,1998.

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