Cu-Cr-Zr合金时效强化机理
苏娟华,刘平,董企铭,李贺军,任风章,田保红
摘要(Abstract)：
研究了不同时效工艺对Cu-0.7Cr-0.13Zr合金硬度、强度和导电率性能的影响,利用透射电镜分析合金时效后的微观形态和析出相。结果表明:在500℃时效30min析出相为Cu5Zr,硬度和导电率可达116.7HV和47%IACS。500℃时效6h后,硬度和导电率为140HV和76%IACS,强度达到峰值430MPa,弥散共格的析出相Cr是强度提高的重要原因,强化效应与采用共格强化机理计算的结果非常接近。合金在500℃时效8h硬度和强度仍具有135.6HV和410MPa,导电率为77%IACS,析出相仍较细小但与基体失去共格关系。
关键词(KeyWords)： Cu-0.7Cr-0.13Zr合金;时效;共格强化;强度
基金项目(Foundation): 国家高技术研究发展计划项目(2002AA331112);; 西北工业大学博士论文创新基金
作者(Author): 苏娟华,刘平,董企铭,李贺军,任风章,田保红
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