颗粒对铝基复合材料热残余应力的影响Effect of particle on thermal residual stress in aluminum matrix composite
张建云,邹晋,周贤良,华小珍
摘要(Abstract):
采用有限元方法对SiCp/Al复合材料制备冷却后的热残余应力进行了数值模拟,建立平面应力单颗粒及多颗粒复合材料几何模型,研究了颗粒形貌及体积分数对复合材料热残余应力的影响。结果表明,复合材料中颗粒和基体的界面附近存在较大的热残余应力,球形颗粒模型热残余应力比方形颗粒模型热残余应力小,多颗粒模型中应力分布较复杂,复合材料热残余应力随颗粒体积分数增加而增大。
关键词(KeyWords): 铝基复合材料;SiC颗粒;热残余应力;有限元方法
基金项目(Foundation): 江西省自然科学基金(2007GZC1634);; 航空科学基金(2007ZF56016);; 江西省教育厅科技基金(GJJ08233)
作者(Author): 张建云,邹晋,周贤良,华小珍
参考文献(References):
- [1]崔岩.碳化硅颗粒增强铝基复合材料的航空航天应用[J].材料工程,2002(6):3-6.CUI Yan.Aerospace applications of silicon carbide particulate reinforced aluminium matrix composites[J].Journal of Materials Engineering,2002(6):3-6.
- [2]Warren H,Darrell R.Aluninum metal matrix composites[J].Advanced Materials&Processes,2004(2):39-42.
- [3]龙乐.电子封装中的铝碳化硅及其应用[J].电子与封装,2006,(6):16-20.LONG Le.AlSiC metal matrix composites and its application in microelectronics packaging[J].Electronics&Packaging,2006,(6):16-20.
- [4]Carl Zweben.Advanced materials for optoelectronic packaging[J].Optoelectronics,2002(9):37-40.
- [5]Izciler M,Muratoglu M.Behavior of SiC reinforced 2124 Al alloy composite in RWAT system[J].Journal of Materials Processing Technology,2003,132(1-3):67-72.
- [6]Fei W D,Hu M,Yao C K.Thermal expansion and thermal mismatch stress relaxation behaviors of SiC reinforced aluminum composite[J].MaterialsChemistry and Physics,2002,77:882-888.
- [7]吴晶,李文芳,蒙继龙.金属基复合材料的热残余应力力学模型研究进展[J].材料科学与工程学报,2003,21(2):289-292.WU Jing,LI Wen-fang,MENG Ji-long.Development of mechanics model of thermal residual stress in metal matrix composites[J].Materials Science andEngineering,2003,21(2):289-292.
- [8]Capela C.Thermal stress analysis in particulate composite components[J].Strain,2003,39:49-56.
- [9]张建云,王磊,周贤良,等.高体积分数SiCp/Al复合材料的热物理性能[J].兵器材料科学与工程,2006,29(3):10-13.ZHANG Jian-yun,WANG Lei,ZHOU Xian-liang,et al.Thermophysical properties of high volume fraction SiCp/Al composite[J].Ordnance Material Scienceand Engineering,2006,29(3):10-13.
- [10]黄德彬.有色金属材料手册[M].北京:化学工业出版社,2005:211.
- [11]黄强,顾明元,金燕萍.电子封装材料的研究现状[J].材料导报,2000,14(9):28-32.HUANG Qiang,GU Ming-yuan,JIN Yan-ping.Current status of research on electronic packaging materials[J].Journal of Materials,2000,14(9):28-32.
- [12]Geiger Alan L,Jackson Michael.Low expansion MMCs boost avionics[J].Advanced Materials Processes,1989(7):23-30.
- [13]韩媛媛,李凤珍,武高辉,等.颗粒形状对铝基复合材料热残余应力影响的有限元分析[J].哈尔滨理工大学学报,2003,8(5):83-87.HAN Yuan-yuan,LI Feng-zhen,WU Gao-hui,et al.Finite element analysis of the effect of particle shape on the thermal residual stress in Al matrix composites[J].Journal of Harbin University of Science and Technology,2003,8(5):83-87.
- [14]许崇海,孙德明,冯衍霞.多相复合陶瓷刀具残余热应力的有限元模拟[J].复合材料学报,2001,18(3):91-96.XU Chong-hai,SUN De-ming,FENG Yan-xia.Finite element modeling of the residual thermal stresses in multiphase composite ceramic tool material[J].ActaMaterial Composite Sinica,2001,18(3):91-96.
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