王梅玲,杨志刚,张弛,王海,高思田

• 1:中国计量科学研究院
• 2:清华大学材料学院

摘要(Abstract)：

通过自组装层法、磁控溅射依次在Si O2基底上化学镀制备了Ni-Mo-P、Cu薄膜,薄膜厚度和成分通过X射线荧光仪(XRF)测定。对Si O2/Ni-Mo-P/Cu体系进行了400~600℃的热处理,利用X射线衍射仪(XRD)对物相结构的稳定性进行了测定,利用场发射扫描电镜(FE-SEM)和电子能谱仪(EDS)对表面形貌的稳定性进行了观察和成分分析。结果表明,在400和500℃热处理后,体系稳定性良好,但在较快的降温速率(40℃/min)条件下,Si O2/Ni-Mo-P/Cu体系在600℃热处理后失效,根据热失配应力,提出了薄膜破裂模型,Ni-Mo-P薄膜与Si O2界面断裂能为2.12 J/m2。Cu薄膜在600℃热处理时发生团聚,Cu在Ni-Mo-P上的团聚激活能为1.15 e V,大于Cu在Si O2上的团聚激活能0.6 e V。

关键词(KeyWords)： 热稳定性;热失配应力;团聚;断裂

Abstract:

Keywords:

基金项目(Foundation): 国家科技支撑计划项目(2011BAK15B05)

作者(Author): 王梅玲,杨志刚,张弛,王海,高思田

DOI: 10.13289/j.issn.1009-6264.2015.07.030

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